tag: thermal modeling

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt "In this work, we propose a new task mapping heuristic that leverages in-package wireless t... » read more

No Hot Products
By Mike Donnelly - 14 Sep, 2023 - Comments: 0

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component manufacturers and their OEM customers increasingly battle thermal design issues. Analog electronic component manufacturers have traditionally provided models in SPICE format so customers can sim... » read more

Electro-Thermal Design Breakthrough
By Siemens EDA - 13 Sep, 2023 - Comments: 0

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Adding Circuit Aging To Variability
By Brian Bailey - 12 Aug, 2021 - Comments: 0

Moving to a smaller node usually means another factor becomes important. The industry has become accustomed to doing process, temperature, voltage (PVT) corner analysis, but now it has to add aging into that mix. The problem is that planning for circuit aging is no longer a purely statistical process. Aging is dependent on activity over the lifetime of the device. Tools need to be modified a... » read more

Thermal Impact On Reliability At 7/5nm
By Ed Sperling - 28 Sep, 2018 - Comments: 0

Haroon Chaudhri, director of RedHawk Analysis Fusion at Synopsys, talks about why thermal analysis is shifting left in the design cycle and why this is so critical at the most advanced process nodes. https://youtu.be/wjkrEFLb2vY » read more

Multi-Die Packaging And Thermal Superposition Modeling
By eSilicon - 25 Apr, 2018 - Comments: 0

Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

Controlling Heat
By Ann Mutschler - 12 Sep, 2016 - Comments: 0

Modeling on-chip thermal characteristics and chip-package interactions is becoming much more critical for advanced designs, but how to get there isn't always clear. Every chip, based on its target application, has a thermal design power (TDP) target. This is the typical power it can consume without overreaching the acceptable thermal limits in its intended environment. But in order to rate t... » read more

Intel Acquires Docea Power
By Brian Bailey - 14 Aug, 2015 - Comments: 0

Intel has quietly done another EDA acquisition, this time buying Docea Power, a small company based in Moirans, France. Docea had high-level power and thermal estimation tools. The acquisition closed July 31st. [getentity id="22222" comment="Docea Power"] was founded by two brothers, [getperson id="11137" p_name="Ghislain"] and [getperson id="11138" p_name="Sylvian"] Kaiser. Ghislain had spe... » read more

FinFET Reliability Issues
By Arvind Vel - 13 Mar, 2014 - Comments: 0

The 16nm FinFET node has introduced several new challenges in the IC design community. In addition to the complexity of power-noise and electromigration (EM) verification, thermal reliability has become a major concern for both chip and package designers. With the three-dimensional architecture of FinFET devices, new simulation approaches are being used to model thermal behavior of the die in o... » read more

Hot Stuff
By Ann Mutschler - 14 Mar, 2013 - Comments: 0

By Ann Steffora Mutschler When it comes to thermal modeling, which has been practiced for many years, the challenges are daunting. The good news is that approaches are emerging as challenges increased with smaller process nodes and design complexity. Viewed from a number of viewpoints—transistor, chip, package, board and system—thermal models traditionally have been created from m... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy