Author's Latest Posts


The Evolution of DRAM


DRAM has been around since 1966, but today it's still the same basic 1T 1C bit cell architecture. Yet changes are coming as DRAM is called upon to store and retrieve more data faster. Steve Woo, distinguished inventor and fellow at Rambus, talks about how DRAM works, why there are different flavors, the impact of cooling new solutions in denser configurations, and ongoing issues involving the s... » read more

Using AI For Fault Detection And Classification In Manufacturing


Third in a seven-part series: Classic fault detection and classification has some classic problems. It's reactive, time-consuming to set up, and any product change involves significant man-hours. Even then, it still misses a lot of problems, which result in scrap. This is where machine learning can excel, because it can sift through huge amounts of data from thousands of sensors and find outlie... » read more

Security Requirements And Penalties Grow For Chipmakers


Governments and systems companies are fundamentally changing the rules around semiconductor security, forcing chipmakers and their suppliers to comply with tough new regulations that require resiliency in hardware. Unlike in the past, chips and systems deployed in these markets must be able to respond to threats rather than waiting for the next version of a chip or IP to address vulnerabilities... » read more

Challenges In Stacking HBM


AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

AI’s Value In Chip Design Depends On Data Availability


Experts at the Table: Semiconductor Engineering sat down to discuss the advantages and challenges in using AI in designing chips, with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at Synopsys; Sailesh Kumar, CEO of Baya Systems; Mehir ... » read more

Preparing For The Quantum Computing Age


Within a decade, quantum computers will be able to break virtually any encryption algorithm in use today. What used to be science fiction is on its way to becoming a commercial reality. Once that happens, quantum computers will be able to crack in minutes what was supposed to be unbreakable for more than a century using the most powerful computers available. Erik Wood, senior director of crypto... » read more

Advanced Part Average Testing For Chips


Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies. In the past, PAT produced a Gaussian distribution that made it relatively simple to find outliers. That's no longer the case. Advanced packaging and leading-edge designs have unique attributes that determine which rules apply, such as the thickness o... » read more

Machine Learning In Semiconductor Manufacturing


Second in a seven-part series: Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but it remains relevant even today. It can be applied to semiconductor fab for such things as predictive maintenance of manufacturing equipment, rather than just maintenance on a schedule, which decreases downtime. But getting this right is har... » read more

Best Options For Using AI In Chip Design


Experts at the Table: Semiconductor Engineering sat down to discuss how and where AI can be applied to chip design to maximize its value, and how that will impact the design process, with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at S... » read more

AI, From A To Z


First in a seven-part series: What's the difference between AI, ML, DL, LLMs, and agentic AI? Is it truly revolutionary, or is it an evolutionary series of steps that have enabled machines to do much more than in the past? Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about the evolution of AI over nearly 70 years, the chain of innovation that has enable... » read more

← Older posts Newer posts →