Author's Latest Posts

Rethinking Watermark: Providing Proof of IP Ownership in Modern SoCs
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Intellectual property (IP) cores are essential to creating modern system-on-chips (SoCs). Protecting the IPs deployed in modern SoCs has become more difficult as the IP houses have been established across the globe over the past three decades. The threat posed by IP piracy and overuse has been a topic of research for the past decade or so and has led to creation of a field called wat... » read more

Interfacial ferroelectricity in marginally twisted 2D semiconductors
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Twisted heterostructures of two-dimensional crystals offer almost unlimited scope for the design of new metamaterials. Here we demonstrate a room temperature ferroelectric semiconductor that is assembled using mono- or few-layer MoS2. These van der Waals heterostructures feature broken inversion symmetry, which, together with the asymmetry of atomic arrangement at the interface of tw... » read more

A Low-Power BLS12-381 Pairing Cryptoprocessor for Internet-of-Things Security Applications
By Technical Paper Link - 21 Feb, 2022 - Comments: 0

Abstract: "We present the first BLS12-381 elliptic-curve pairing cryptoprocessor for Internet-of-Things (IoT) security applications. Efficient finite-field arithmetic and algorithm-architecture co-optimizations together enable two orders of magnitude energy savings. We implement several countermeasures against timing and power side-channel attacks. Our cryptoprocessor is programmable to provid... » read more

The Wiretap Channel for Capacitive PUF-Based Security Enclosures
By Technical Paper Link - 19 Feb, 2022 - Comments: 0

Abstract: "In order to protect devices from physical manipulations, protective security enclosures were developed. However, these battery-backed solutions come with a reduced lifetime, and have to be actively and continuously monitored. In order to overcome these drawbacks, batteryless capacitive enclosures based on Physical Unclonable Functions (PUFs) have been developed that generate a key-e... » read more

Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices
By Technical Paper Link - 19 Feb, 2022 - Comments: 0

Abstract "As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategies. Owing to the increasing complexity of the design architectures, optical metrology techniques including spectroscopic ellipsometry (SE) and ref... » read more

Excess noise in high-current diamond diodes
By Technical Paper Link - 17 Feb, 2022 - Comments: 0

Abstract "We report the results of an investigation of low-frequency excess noise in high-current diamond diodes. It was found that the electronic excess noise of the diamond diodes is dominated by the 1/f and generation-recombination noise, which reveals itself as Lorentzian spectral features (f is the frequency). The generation-recombination bulges are characteristic of diamond diodes with l... » read more

A high speed processor for elliptic curve cryptography over NIST prime field
By Technical Paper Link - 17 Feb, 2022 - Comments: 0

Abstract "Elliptic curve cryptography (ECC), as one of the public key cryptography systems, has been widely applied to many security applications. It is challenging to implement a scalar multiplication (SM) operation which has the highest computational complexity in ECC. In this study, we propose a hardware processor which achieves high speed and high security for ECC. We first present a three... » read more

Topology for Substrate Routing in Semiconductor Package Design
By Technical Paper Link - 15 Feb, 2022 - Comments: 0

Abstract: In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, whi... » read more

Multi-Task Network Pruning and Embedded Optimization for Real-time Deployment in ADAS
By Technical Paper Link - 15 Feb, 2022 - Comments: 0

Abstract: "Camera-based Deep Learning algorithms are increasingly needed for perception in Automated Driving systems. However, constraints from the automotive industry challenge the deployment of CNNs by imposing embedded systems with limited computational resources. In this paper, we propose an approach to embed a multi- task CNN network under such conditions on a commercial prototy... » read more

Label-Free C-Reactive Protein Si Nanowire FET Sensor Arrays With Super-Nernstian Back-Gate Operation
By Technical Paper Link - 13 Feb, 2022 - Comments: 0

Abstract: "We present a CMOS-compatible double gate and label-free C-reactive protein (CRP) sensor, based on silicon on insulator (SOI) silicon nanowires arrays. We exploit a reference subtracted detection method and a super-Nernstian internal amplification given by the double gate structure. We overcome the Debye screening of charged CRP proteins in solutions using antibodies fragments as c... » read more

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