Blog Review: Oct. 2
By Jesse Allen - 02 Oct, 2019 - Comments: 0

In a video, Cadence's Tom Hackett explains finite element analysis by looking at a simple model of a bridge and showing why FEA techniques are required for analysis of real-world structures. Synopsys' Taylor Armerding examines why the 156-year-old False Claims Act has new relevance when companies are accused of failing to meet cybersecurity standards. Mentor's Colin Walls demystifies memo... » read more

What is Card-on-file EMV Payment Tokenization
By Rambus - 02 Oct, 2019 - Comments: 0

The way we pay is changing. Consumers are now using their PC, smartphones, wearable devices and even cars to buy goods and services. The size and value of the card-not-present (CNP) market, therefore, is increasing exponentially as payment use-cases across e-commerce, m-commerce and the Internet of Things (IoT) emerge and mature. Understand the risk of card-not-present fraud, learn how to... » read more

Configure, Confirm, Ship: Build Secure Processor-Based Systems with Faster Time-to-Market
By Synopsys - 02 Oct, 2019 - Comments: 0

Security is a first-order design requirement for processor-based systems. Processor designers implement security functionality directly into the hardware itself to protect the system at its most fundamental layer. System integrators that use processor IP such as Synopsys’ DesignWare ARC processors must ensure that they configure and manage the protection and security features correctly, and t... » read more

Where Is The Edge?
By Ed Sperling - 02 Oct, 2019 - Comments: 0

Mike Fitton, senior director of strategic planning at Achronix, talks about what the edge will look like, how that fits in with the cloud, what the requirements are both for processing and for storage, and how this concept will evolve.   Edge Knowledge Center Top stories, videos, blogs, white papers all related to the Edge » read more

Manufacturing Bits: Oct. 1
By Mark LaPedus - 01 Oct, 2019 - Comments: 0

3D balloon printing Using an elastomeric or stretchy balloon, the University of Houston and the University of Colorado have developed a new 3D printing method as a means to develop three-dimensional curvy electronic products. The technology involves the field of 3D printing, sometimes known as additive manufacturing (AM). In 3D printing, the goal is to develop parts layer-by-layer using mat... » read more

Power/Performance Bits: Oct. 1
By Jesse Allen - 01 Oct, 2019 - Comments: 0

Nighttime power Researchers at UCLA and Stanford University created a low-cost device that harnesses radiative cooling to provide a small amount of renewable energy at night. While the device only provides a small amount of power, it could be useful for areas without reliable electricity or access to batteries. Radiative cooling happens when a surface that faces the sky emits heat as therma... » read more

System Bits: Oct. 1
By Jeff Dorsch - 01 Oct, 2019 - Comments: 0

Jumping the gap in microchips A quasi-particle that travels along the interface of a metal and dielectric material may be the solution to problems caused by shrinking electronic components, according to an international team of engineers. "Microelectronic chips are ubiquitous today," said Akhlesh Lakhtakia, Evan Pugh University Professor and Charles Godfrey Binder Professor of Engineering S... » read more

Security Tradeoffs In A Shifting Global Supply Chain
By Ed Sperling - 30 Sep, 2019 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Sep, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

Influence Of SiGe On Parasitic Parameters in PMOS
By Coventor - 27 Sep, 2019 - Comments: 0

In this paper, simulation-based design-technology co-optimization (DTCO) is carried out using the Coventor SEMulator3D virtual fabrication platform with its integrated electrical analysis capabilities [1]. In our study, process modeling is used to predict the sensitivity of FinFET device performance to changes in a silicon germanium epitaxial process. The simulated process is a gate-last flow p... » read more

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