Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

A Novel Approach To Mitigating RowHammer Attacks And Improving Server Memory System Reliability
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “RAMPART: RowHammer Mitigation and Repair for Server Memory Systems” was published by researchers at Rambus. Abstract: "RowHammer attacks are a growing security and reliability concern for DRAMs and computer systems as they can induce many bit errors that overwhelm error detection and correction capabilities. System-level solutions are needed as process technology... » read more

CMOS-Based HW Topology For Single-Cycle In-Memory XOR/XNOR Operations
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “CMOS-based Single-Cycle In-Memory XOR/XNOR” was published by researchers at University of Tennessee, University of Virginia, and Oak Ridge National Laboratory (ORNL). Abstract: "Big data applications are on the rise, and so is the number of data centers. The ever-increasing massive data pool needs to be periodically backed up in a secure environment. Moreover, a ... » read more

Modulated Electron Microscopy Applied In The Process Monitoring Of Memory Cell And The Defect Inspection Of Floating Circuits
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “In situ electrical property quantification of memory devices by modulated electron microscopy” was published by researchers at Hitachi High-Tech Corporation, KIOXIA Corporation, and Western Digital. Abstract: "E-beam inspection based on voltage-contrast (VC) defect metrology has been widely utilized for failure mode analysis of memory devices. Variation in e-beam... » read more

Discrete Noise Approximation When Modeling The Effects Of Noise On Quantum Circuits
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “The Discrete Noise Approximation in Quantum Circuits” was published by researchers at HQS Quantum Simulations. Abstract: "When modeling the effects of noise on quantum circuits, one often makes the assumption that these effects can be accounted for by individual decoherence events following an otherwise noise-free gate. In this work, we address the validity of th... » read more

A Survey Of Recent Advances And Research Activities In Wireless NoC Security
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “Wireless Network-on-Chip Security Review: Attack Taxonomy, Implications, and Countermeasures” was published by researchers at Macquarie University (Sydney). Abstract: "Network-on-chip (NoC) is a critical on-chip communication framework that underpins high-performance multicore computing and network system architectures. Its adoption has become widespread due to t... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

DRAM Test And Inspection Just Gets Tougher
By Anne Meixner - 07 Nov, 2023 - Comments: 0

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

Rebalancing Test And Yield In IC Manufacturing
By Gregory Haley - 07 Nov, 2023 - Comments: 0

Balancing yield and test is essential to semiconductor manufacturing, but it's becoming harder to determine how much weight to give one versus the other as chips become more specialized for different applications. Yield focuses on maximizing the number of functional chips from a production batch, while test aims to ensure that each chip meets rigorous quality and performance standards. And w... » read more

Addressing Trench Structures And Larger Wafers For Power Devices
By Vamsi Velidandla - 07 Nov, 2023 - Comments: 0

Wind power. Rail. Solar energy. And, perhaps most significantly, electric and hybrid vehicles. Together, these four forces are among the major demand drivers for power devices. While silicon (Si) still plays a role in power devices, wide-bandgap compound semiconductors like silicon carbide (SiC) and gallium nitride (GaN) are particularly well-suited for power devices thanks to their higher e... » read more

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