Printed Electronics: Direct Flipchip Bonding of Ultra-Thin Chip On A Recently-Developed Stretchable Substrate
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A new technical paper titled "Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation" was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies. Abstract "Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-... » read more

Using Formal Verification To Optimize HLS-Produced Circuits (ETH Zurich)
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A new technical paper titled "Eliminating Excessive Dynamism of Dataflow Circuits Using Model Checking" was published by researchers at ETH Zurich. Abstract "Recent HLS efforts explore the generation of dynamically scheduled, dataflow circuits from high-level code; their ability to adapt the schedule at runtime to particular data and control outcomes promises superior performance to standar... » read more

Ternary LIM Operation of the TNAND and TNOR Universal Gates Using DG Feedback FETs
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A technical paper titled "Logic-in-Memory Operation of Ternary NAND/NOR Universal Logic Gates using Double-Gated Feedback Field-Effect Transistors" was published by researchers at Korea University. Abstract "In this study, the logic-in-memory operations are demonstrated of ternary NAND and NOR logic gates consisting of double-gated feedback field-effect transistors. The component transistor... » read more

Microarchitectural Side-Channel Attacks And Defenses On Non-Volatile RAM
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A new technical paper titled "NVLeak: Off-Chip Side-Channel Attacks via Non-Volatile Memory Systems" was written (preprint) by researchers at UC San Diego, UT Austin, and Purdue University. Abstract "We study microarchitectural side-channel attacks and defenses on non-volatile RAM (NVRAM) DIMMs. In this study, we first perform reverse-engineering of NVRAMs as implemented by the Intel Optane... » read more

Fast Parallel Multi-HDL Compiler (UC Santa Cruz)
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A technical paper titled "A Multi-threaded Fast Hardware Compiler for HDL" was published by researchers at UC Santa Cruz. Abstract: "A set of new Hardware Description Languages (HDLs) are emerging to ease hardware design. HDL compilation time is a major bottleneck in the designer’s productivity. Moreover, as the HDLs are developed independently, the possibility to share innovations in com... » read more

Energy-Efficient Execution Scheme For Dynamic Neural Networks on Heterogeneous MPSoCs
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A technical paper titled "Map-and-Conquer: Energy-Efficient Mapping of Dynamic Neural Nets onto Heterogeneous MPSoCs" was published (preprint) by researchers at LAMIH/UMR CNRS, Universite Polytechnique Hauts-de-France and UC Irvine. Abstract "Heterogeneous MPSoCs comprise diverse processing units of varying compute capabilities. To date, the mapping strategies of neural networks (NNs) onto ... » read more

Fabricating Multi-Walled Carbon Nanotubes On Plastic Film
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A new technical paper titled "Direct formation of carbon nanotube wiring with controlled electrical resistance on plastic films" was published by researchers at Tokyo University of Science. The paper states, "we have developed a simple method to fabricate multi-walled carbon nanotube (MWNT) wiring on a plastic film at room temperature under atmosphere pressure. By irradiating a MWNT thin fil... » read more

Asynchronously Parallel Optimization Method For Sizing Analog Transistors Using Deep Neural Network Learning
By Technical Paper Link - 03 Mar, 2023 - Comments: 0

A new technical paper titled "APOSTLE: Asynchronously Parallel Optimization for Sizing Analog Transistors Using DNN Learning" was published by researchers at UT Austin and Analog Devices. Abstract "Analog circuit sizing is a high-cost process in terms of the manual effort invested and the computation time spent. With rapidly developing technology and high market demand, bringing automated s... » read more

Agile HW Design: Fully Automatic Equivalence Checking Workflow
By Technical Paper Link - 03 Mar, 2023 - Comments: 0

A new technical paper titled "An Equivalence Checking Framework for Agile Hardware Design" was published by researchers at Portland State University and Intel. Abstract "Agile hardware design enables designers to produce new design iterations efficiently. Equivalence checking is critical in ensuring that a new design iteration conforms to its specification. In this paper, we introduce an eq... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

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