Automate Memory Test Through A Shared Bus Interface
By Harshitha Kodali - 12 Apr, 2022 - Comments: 0

The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point for testing the memories. A shared bus architecture allows testing and repairing memories within IP cores through a single access point referred to as a shared bus interface. Within this interface... » read more

Case Study — 3D Wire Bond Inspection and Metrology
By CyberOptics - 12 Apr, 2022 - Comments: 0

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Detecting Spatial Blotches In Image Sensor Devices
By Christos Pantelidis - 12 Apr, 2022 - Comments: 0

One of the most common defects in image sensor devices is spatial blotches. The appearance of blotches in image sensors is a regular occurrence and may be generated by internal moving parts or may be moved by air currents within the camera. Composed of two main statistical methods, the first module employs an inferential method, applying a spatial segmentation of the current frame to obtain ... » read more

Extracting Intrinsic Mechanical Properties Of Thin Low-Dielectric Constant Materials With iTF Analysis
By Bruker - 12 Apr, 2022 - Comments: 0

This white paper focuses on the optimization and use of Bruker’s iTF software package for the extraction of intrinsic (substrate independent) mechanical properties, particularly for thin, low-k materials. These considerations are split into two main parts: Measurement procedure (Section II) and iTF execution (Section III). The former outlines important aspects of acquiring proper experimental... » read more

Made in the Cloud!
By Synopsys - 12 Apr, 2022 - Comments: 0

While software developers have been building and delivering software in the cloud for many years now, how much IC hardware is “made in the cloud”? We’re here to help you understand the case for IC hardware development in the cloud and answer the most common questions. Download the paper and learn: Why isn’t everybody doing it? Why cloud? Why now? Can you afford to ignore i... » read more

Silicon Lifecycle Management’s Growing Impact On IC Reliability
By Ed Sperling - 12 Apr, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it's expanding and changing, and where the problems are, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University; a... » read more

Electrically pumped laser transmitter integrated on thin-film lithium niobate
By Technical Paper Link - 11 Apr, 2022 - Comments: 0

New research paper from Harvard, in collaboration with Freedom Photonics and HyperLight Corp, and with funding from DARPA and Air Force Office of Scientific Research. Abstract "Integrated thin-film lithium niobate (TFLN) photonics has emerged as a promising platform for the realization of high-performance chip-scale optical systems. Of particular importance are TFLN electro-optic modulato... » read more

Better Video Compression
By Ed Sperling - 11 Apr, 2022 - Comments: 0

Video data is increasing, but bandwidth is not increasing quickly enough. One solution is to compress that data, but the challenge is to do that without impacting resolution. Rob Green, AMD’s senior manager for Pro AV, Broadcast & Consumer, talks about what’s changing in video compression, from new standards to better analytics, virtualization, what impact AR/VR will have, and a compari... » read more

New Challenges For Connected Vehicles
By John Koon - 11 Apr, 2022 - Comments: 0

Connected vehicles are all about convenience and safety. Modern vehicles are connected to the Internet via wireless networks, consumer apps, and infotainment systems, and there is work underway to connect them over 5G to guided driving. But there also are challenges to making all of this work securely, safely, and as expected throughout the expected lifetimes of chips and systems. The goal i... » read more

Data-driven RRAM device models using Kriging interpolation
By Technical Paper Link - 10 Apr, 2022 - Comments: 0

New technical paper from The George Washington University and NIST with support from DARPA and others. Abstract "A two-tier Kriging interpolation approach is proposed to model jump tables for resistive switches. Originally developed for mining and geostatistics, its locality of the calculation makes this approach particularly powerful for modeling electronic devices with complex behavior la... » read more

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