New Ways To Improve Batteries

By Katherine Derbyshire - 20 Jan, 2022 - Comments: 0

Researchers around the world are racing to develop more efficient, denser, and safer battery technology, and they are reaching far beyond where research has gone before. Much of this is being driven by concern over exhaust from internal combustion engines, which are responsible for a significant portion of global CO2 emissions. Nearly all carmakers today have announced plans to develop batte... » read more

The Evolution Of Plasma Process Power

By Peter Gillespie - 20 Jan, 2022 - Comments: 0

The year 1981 was notable for a variety of technology breakthroughs. It saw the inaugural mission of the Space Shuttle Columbia and the debut of the DeLorean car. The IBM PC, Commodore 64, and the ZX81 were among the personal computers to hit store shelves. It also marked the year, four decades ago, that Advanced Energy was founded and took its first steps towards a mission to enable custom... » read more

Semiconductor Industry Faces Stiff Competition For Talent

By Tim Archer - 20 Jan, 2022 - Comments: 0

For decades, the semiconductor industry has been defined by our ability to innovate. Each time we’ve been faced with seemingly insurmountable technological challenges, we have invented innovative approaches and methods to solve them, and in doing so, we’ve helped to transform how the world works, plays, learns, and connects. Today, we are again faced with a critical new challenge: the gl... » read more

Sustainability In Creating Next-Gen Materials

By Jessica Albright - 20 Jan, 2022 - Comments: 0

In recent years, sustainable manufacturing has become increasingly vital in the materials industry with growing concerns about the impact of manufacturing on the environment. Minimizing the intrinsic risks associated with any manufacturing operation while maximizing the quality and opportunities that arise with improved products is and should be the goal of almost every manufacturer today. At... » read more

Future Challenges For Advanced Packaging

By Mark LaPedus - 20 Jan, 2022 - Comments: 1

Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Reasserting U.S. Leadership in Microelectronics (MIT)

By Technical Paper Link - 19 Jan, 2022 - Comments: 0

In this new paper, MIT researchers lay out a vision and approach for how universities can help the U.S. regain leadership as a semiconductor superpower. The paper looks at education and workforce development, research, technology translation, startups, intellectual property, academic infrastructure and regional network efficiencies. Find the paper here and the MIT news writeup from 1/19/2022... » read more

Will Steering Wheels Ever Disappear?

By Bryon Moyer - 19 Jan, 2022 - Comments: 3

Autonomous vehicles are touted as the way of the future, and the general assumption is ultimately everything will be autonomous. But there are broad segments of the market where autonomy is unlikely to happen. There is no question that autonomy is possible. In fact, within certain bounds it's already here. Robo-taxis are available in some cities. Mercedes, Tesla, and Lexus are all touting so... » read more

Blog Review: Jan. 19

By Jesse Allen - 19 Jan, 2022 - Comments: 0

Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

Metal Thermal Interface Material For The Next Generation FCBGA

By Amkor - 19 Jan, 2022 - Comments: 0

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array (FCPGA) packaging. As the next generation devices' requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A typical TIM applies a poly... » read more

Storing and Reading Information in Mixtures of Fluorescent Molecules

By Technical Paper Link - 18 Jan, 2022 - Comments: 0

Abstract "The rapidly increasing use of digital technologies requires the rethinking of methods to store data. This work shows that digital data can be stored in mixtures of fluorescent dye molecules, which are deposited on a surface by inkjet printing, where an amide bond tethers the dye molecules to the surface. A microscope equipped with a multichannel fluorescence detector distinguishes ... » read more

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