Radiation Hardening Chips For Outer Space
By Ed Sperling - 14 Dec, 2021 - Comments: 0

What’s the difference between radiation tolerant and radiation hardening, and where is each one used? Minal Sawant, director of the aerospace and defense vertical market at Xilinx, talks about different striations in the Earth’s atmosphere, how those various levels can affect radiation, and what impact that has on the functionality of increasingly dense chip circuits over extended periods o... » read more

Manufacturing Bits: Dec. 14
By Mark LaPedus - 14 Dec, 2021 - Comments: 0

3D-SOCs At this week’s IEEE International Electron Devices Meeting (IEDM), a plethora of companies, R&D organizations and universities presented papers on the latest and greatest technologies. One of the themes at IEDM is advanced packaging, a technology enables an IC vendor to boost the performance of a chip. Advanced forms of packaging also enables new 3D-like chip architectures. Fo... » read more

Power/Performance Bits: Dec. 14
By Jesse Allen - 14 Dec, 2021 - Comments: 0

Improved digital sensing Researchers from Imperial College London and Technical University of Munich propose a technique to improve the capability of many different types of sensors. The method addresses voltage limits in analog-to-digital converters and the saturation that results in poor quality when an incoming signal exceeds those limits. “Our new technique lets us capture a fuller ra... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Motional narrowing, ballistic transport, and trapping of room-temperature exciton polaritons in an atomically-thin semiconductor
By Technical Paper Link - 10 Dec, 2021 - Comments: 0

Abstract "Monolayer transition metal dichalcogenide crystals (TMDCs) hold great promise for semiconductor optoelectronics because their bound electron-hole pairs (excitons) are stable at room temperature and interact strongly with light. When TMDCs are embedded in an optical microcavity, excitons can hybridise with cavity photons to form exciton polaritons, which inherit useful properties from... » read more

Efficient Ohmic contacts and built-in atomic sublayer protection in MoSi2N4 and WSi2N4 monolayers
By Technical Paper Link - 10 Dec, 2021 - Comments: 0

Abstract "Metal contacts to two-dimensional (2D) semiconductors are often plagued by the strong Fermi level pinning (FLP) effect which reduces the tunability of the Schottky barrier height (SBH) and degrades the performance of 2D semiconductor devices. Here, we show that MoSi2N4 and WSi2N4 monolayers—an emerging 2D semiconductor family with exceptional physical properties—exhibit stron... » read more

Solution Processable Pentafluorophenyl EndCapped Dithienothiophene Organic Semiconductors for Hole Transporting Organic Field Effect Transistors
By Technical Paper Link - 10 Dec, 2021 - Comments: 0

Abstract: "Two solution‐processable organic semiconductors, DFPT‐DTTR (1) and DFPbT‐DTTR (2), composed of pentafluorophenyl (FP) end‐capped 3,5‐dialkyl dithienothiophene (DTTR) core with thiophene (T) or bithiophene (bT) as π‐bridged spacers are developed and investigated for their optical, electrochemical, microstructural, and electrical properties. With more conjugated bithiophe... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Dec, 2021 - Comments: 0

Intel intends to take Mobileye public in mid-2022 on a US market through an IPO of newly issued stock. The subsidiary, which Intel acquired in 2017, develops SoCs for ADAS and autonomous driving solutions. Mobileye has achieved record revenue year-over-year with 2021 gains expected to be more than 40 percent higher than 2020, highlighting the powerful benefits to both companies of our ongoing p... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 10 Dec, 2021 - Comments: 0

Pervasive computing An outage in network equipment at the US-EAST-1 Region of Amazon Web Services this week reminded customers of the downside to having every appliance run via a data center. Users accessing apps tied to AWS on the East coast found services did not work, including Alexa, Ring, smart appliances, some Amazon warehouses and packaging delivery, web APIs such as Slack, and some str... » read more

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