Securing The IoT Begins With Zero-Touch Provisioning At Scale
By Infineon - 04 Aug, 2021 - Comments: 0

The path to secured IoT deployments starts with a hardware root-of-trust at the device level, a simple concept that belies the complexity of managing a chain of trust that extends from every edge device to the core of the network. The solution to this management challenge, based on a coordinated effort of domain experts, is a zero touch “chip-to-cloud” provisioning service for certificates-... » read more

Solution Efficiencies For Dynamic Function eXchange Using Abstract Shells
By Xilinx - 04 Aug, 2021 - Comments: 0

Dynamic Function eXchange (DFX) enables great flexibility within Xilinx® silicon, empowering you to load applications on demand, deliver updates to deployed systems, and reduce power consumption. Platform designs allow for collaboration between groups, where one group can focus on infrastructure and another on hardware acceleration. However, DFX has fundamental flow requirements that lead to l... » read more

Securing 5G And IoT With Fuzzing
By Synopsys - 04 Aug, 2021 - Comments: 0

5G will revolutionize many industries, with up to 100 times the speed, 100 times the capacity, and one-tenth the latency compared to 4G LTE. But in addition to providing superior performance, 5G expands the attack surface of apps and IoT devices that rely on this next-gen network. In addition to known security exploits, we’re bound to see unknown, novelty attacks. Fuzz testing (or fuzzing)... » read more

Beyond Bug Hunting: Verification Coverage From Safety To Certification
By OneSpin Solutions - 04 Aug, 2021 - Comments: 0

Understanding verification coverage is critical for meeting IC integrity standards and goes well beyond detecting bugs in the design. Without proper verification coverage metrics, meeting strict safety standards and certification may not be achievable. Precise metrics indicate where there are gaps in verification and provide a clear view of the progress being made in the verification effort. Co... » read more

Blog Review: Aug. 4
By Jesse Allen - 04 Aug, 2021 - Comments: 0

Cadence's Paul McLellan listens in as industry luminaries celebrate 50 years of the microprocessor with a discussion on major challenges to the growth of microprocessors, inflection points over the last 50 years, and predictions for the next 25. Siemens EDA's Vladimir Kirichenko warns that designing electrical and thermal systems separately may lead to various problems such as late design ch... » read more

Startup Funding: July 2021
By Jesse Allen - 04 Aug, 2021 - Comments: 0

The trend of big funding for Chinese autonomous driving companies continued in July, with three startups each drawing $100M or more for efforts in ADAS and computer vision for automotive. The month also saw one electric vehicle manufacturer get a massive boost as it begins production on its first models, while significant funding also went to a company that wants to recycle used up EV batteries... » read more

5G Communications
By Cadence - 04 Aug, 2021 - Comments: 0

This white paper examines the recent advances that the modeling, simulation, and design automation capabilities in Cadence® AWR® software are helping designers develop the antenna and RF front-end components that are making 5G a reality. This primer offers a breadth of application notes on the innovative wizards and synthesis technologies that enable engineers designing 5G communications syst... » read more

Manufacturing Bits: Aug. 3
By Mark LaPedus - 03 Aug, 2021 - Comments: 0

World’s thinnest magnet Lawrence Berkeley National Laboratory, the University of California at Berkeley and others have developed what researchers say is the world’s thinnest magnet. The one-atom-thin, two-dimensional (2D) magnet could one day pave the way towards new spin electronics or spintronics memory devices and other technologies in the market. Spintronics uses the orientation of... » read more

Using A Virtual DOE To Predict Process Windows And Device Performance Of Advanced FinFET Technology
By Qingpeng Wang - 03 Aug, 2021 - Comments: 0

By Qingpeng Wang, Yu De Chen, Cheng Li, Rui Bao, Jacky Huang, and Joseph Ervin Introduction With continuing finFET device process scaling, micro loading control becomes increasingly important due to its significant impact on yield and device performance [1-2]. Micro-loading occurs when the local etch rate on a wafer is dependent upon existing feature sizes and local pattern density. Uninten... » read more

Power/Performance Bits: Aug. 3
By Jesse Allen - 03 Aug, 2021 - Comments: 0

Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

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