Automotive Chip Shortages: An Assembly Perspective

By Prasad Dhond - 20 May, 2021 - Comments: 0

Since March 2020, the pandemic has brought on scarcity in odd goods like toilet paper, baking flour and exercise equipment. The latest casualty is the auto industry as car production across the world has been hobbled by chip shortages. While much has been written about the role of semiconductor suppliers, foundries, wafer fab equipment, fires, and snowstorms in the chip shortages, we should als... » read more

Robust Growth And Strong Outlook For Semiconductor Materials

By Inna Skvortsova - 20 May, 2021 - Comments: 0

2020 was a year that made a mark in the history of mankind as well as the semiconductor industry. It was a year of business and personal disruptions caused by COVID-19, supply chain interruptions, and exceptional agility of industries coping with the new normal imposed by the pandemic. Nevertheless, it was a year of extraordinary growth for the semiconductor industry, including semiconductor ma... » read more

Advanced Packaging’s Next Wave

By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Potential For 5G In Daily Life

By Krishnan Shrinivasan - 20 May, 2021 - Comments: 0

The excitement around the rollout of 5G technology could not be more palpable. We see this next-generation technology in news headlines and commercials, with promises to usher in the next wave of internet capabilities, speeds, and frictionless internet access. Let’s look at what 5G is and how semiconductor advancements are driving this new technology. What is 5G? 5G technology can be su... » read more

Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization

By Brewer Science - 20 May, 2021 - Comments: 0

In EUV lithography, spin-on silicon hardmasks have been widely used not only as etch transfer layers, but also as assist layers to enhance the lithographic performance of resist. In this study, we demonstrate a novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach. By varying the concentration and type of the functional g... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging

By Amkor - 20 May, 2021 - Comments: 0

Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Automotive IC Shortage Drags On

By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Rethinking Business As Usual

By Rosie Medina - 20 May, 2021 - Comments: 0

Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like nothing any of us have experienced before. QP Technologies has been fortunate to weather the pandemic well – less than 0.05% of our staff has tested positive, w... » read more

Managing Wafer Retest

By Anne Meixner - 19 May, 2021 - Comments: 1

Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and result in poor yield, as well as failures in the field. Achieving this balance requires good wafer probing process procedures as well as monitoring of the resulting process parameters, much of it ... » read more

Blog Review: May 19

By Jesse Allen - 19 May, 2021 - Comments: 0

Cadence's Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S. In a podcast, Siemens EDA's Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardw... » read more

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