Accelerating High-Lift Aerodynamics: Automated Meshing for CFD Excellence


High-lift aerodynamic prediction plays a crucial role in optimizing aircraft performance during takeoff and landing. Yet, capturing the intricacies of boundary layer separation, wake formation, and vortex interactions remains a formidable challenge in computational fluid dynamics (CFD). Learn how to address these hurdles with advanced, automated mesh generation tailored for high-fidelity simula... » read more

Blog Review: Dec. 3


Cadence's Reela Samuel notes that as multi-die integration becomes the new engine of semiconductor performance, the decision between 2.5D and 3D-IC architectures shapes a design's achievable bandwidth, energy efficiency, thermal limits, system size, and even program schedules. Synopsys' Thomas Andersen suggests that the deployment of physical AI will require the fusion of advanced electronic... » read more

Case Study : Autonomous Driving AI Domain Controller


Ambarella’s CV3-AD655 autonomous driving AI domain controller combines energy-efficient compute with Imagination’s IMG BXM GPU to deliver real-time surround-view visualisation for L2++/L3 vehicles. This case study explores the shift to centralized domain controllers, why Ambarella selected IMG BXM, and how this enables greater driver awareness and system trust. Read more here.   ... » read more

SRAM PUF: A Revolutionary Approach to Cryptographic Key Protection


Cryptographic keys are the cornerstone of secure digital systems, enabling encryption, authentication, and data integrity. However, securely storing these keys on-chip presents significant challenges. Traditional methods, such as storing keys in one-time programmable, non-volatile memory, are vulnerable to physical attacks, environmental variations, and lifecycle management issues. Physical Unc... » read more

Optimizing AI Workloads For Edge Computing


Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss how some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president an... » read more

Role of Elastomer Structure in Blending Strategy for Stretchable Semiconducting Thin Films (CAS, RIKEN)


A new technical report titled "Polymer semiconductor blends with remarkably stable semiconducting performance under large and cyclic mechanical deformation" was published by Chinese Academy of Sciences (CAS) and RIKEN Center for Sustainable Resource Science. The paper states: "We report deformable blend thin films of polymer semiconductors with PDPPTT (p-type) and N2200 (n-type) as the ex... » read more

AI With Open And Scaled Data Sharing in IC Manufacturing (NIST)


A new workshop report titled "Artificial Intelligence with Open and Scaled Data Sharing in Semiconductor Manufacturing" was published by NIST. Abstract "The Workshop sponsored by the National Science Foundation (NSF) (NSF award 2334590, "Artificial Intelligence with Open and Scaled Data Sharing in the Semiconductor Industry") and supported by the National Institute of Standards and Techno... » read more

Scalable Fabrication of Nano-OLEDs Smaller Than The Defraction Limit (ETH Zurich, U. of Alberta, IISc)


A technical paper titled "Scalable nanopatterning of organic light-emitting diodes beyond the diffraction limit" was published by researchers at ETH Zurich, University of Alberta, Indian Institute of Science (IISc) and Huazhong University of Science and Technology. Abstract: "Miniaturization of light-emitting diodes below the diffraction limit of the emission wavelength can enable super-r... » read more

Research Bits: Dec. 2


Ionothermoelectric cooling Researchers from the University of Osaka, University of Tokyo, and Japan's National Institute of Advanced Industrial Science and Technology proposed an ionothermoelectric cooling strategy for chips that enhances cooling by driving the flow of ions through nanoscale channels. “We fabricated a nanosized pore in a semiconductor membrane and surrounded the nanopore ... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

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