EDA, IP Revenue Up 15%


EDA and IP revenues blasted off in Q3 of 2020 in every geography and every sector, despite a trade war, a pandemic, and slowdowns in the automotive and avionics sectors. Revenue grew to $2.95 billion, up 15% over the $2.57 billion in the same period in 2019, according to a just-released report from the Electronic System Design Alliance Market Statistic Services (MSS). The four-quarter moving... » read more

Manufacturing Bits: Jan. 11


3D printing with liquids Martin Luther University Halle-Wittenberg (MLU) has developed a way to combine both materials and liquids in 3D printing applications. Researchers from MLU have developed liquid‐filled capsules using 3D printing technology. This in turn enables new medical agents to be incorporated into pharmaceutical products. It also allows liquids to be integrated into material... » read more

Trust Is Not A Good Feeling


As a society, we trust in a lot of things in order for our daily lives to proceed. Trust is embedded in our lives. We trust in everything from the products we use to our relationships we have to our government. But when our trust is broken or shaken in something or someone, it is hard very hard for to for us to have confidence in that something or someone again. If we apply the concept to of... » read more

Photonic Integration Based On A Ferroelectric Thin-Film Platform


Photonic-integrated circuits (PICs) using ferroelectric materials are expected to be used in many applications because of its unique optical properties such as large electrooptic coefficients. In this study, a novel PIC based on a ferroelectric thin-film platform was designed and fabricated, where high-speed optical modulator, spot-size converters (SSCs), and a variable optical attenuator (VOA)... » read more

Multi-Layer Deep Data Performance Monitoring And Optimization


Combining functional and parametric monitoring of the real-world behavior of complex SoCs provides a powerful new approach that facilitates performance optimization during development and in the field, improves security and safety, and enables predictive maintenance to prevent field failures. proteanTecs’ Universal Chip Telemetry (UCT) and Siemens’ Tessent Embedded Analytics are complementa... » read more

Full Metrology Solutions For Advanced RF With Picosecond Ultrasonic Metrology


Picosecond Ultrasonics (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-contact, non-destructive technology and its capabilities for simultaneous multiple layer measurement. Measuring velocity and thickness simultaneously for transparent and semi-transparent films offers a lot of potential for not only monitoring ... » read more

Power/Performance Bits: Jan. 11


Quantum dot transistors Researchers at Los Alamos National Laboratory and University of California Irvine used quantum dots to create transistors which can be assembled into functional logic circuits. "Potential applications of the new approach to electronic devices based on non-toxic quantum dots include printable circuits, flexible displays, lab-on-a-chip diagnostics, wearable devices, me... » read more

IoT Cybersecurity Improvement Act of 2020


The "IoT Cybersecurity Improvement Act of 2020" became a U.S. law on 12/4/2020.   The legislation was passed by unanimous consent by the Senate and the House of Representatives. Congress.Gov states: "This bill requires the National Institute of Standards and Technology (NIST) and the Office of Management and Budget (OMB) to take specified steps to increase cybersecurity for Internet of ... » read more

Week In Review: Manufacturing, Test


Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Week In Review: Design, Low Power


FPGA and eFPGA company Achronix is going public on Nasdaq via a merger with special-purpose acquisition company ACE Convergence Acquisition Corp. (Nasdaq: ACEV). Upon closing of the transaction, the combined operating entity retain the name Achronix Semiconductor Corporation and will be listed under the ticker symbol ACHX. According to Achronix, the transaction reflects an implied equity value ... » read more

← Older posts Newer posts →