RISC-V Custom Instruction Flow Application Note
By Imperas - 23 Nov, 2020 - Comments: 0

A RISC-V processor has several defined decode spaces, for example custom0, custom1 etc. into which new custom instructions can be added. OVP Fast processor models can be extended without modification to the pre-compiled and verified base processor model source code using one or more extension libraries. An extension library can be loaded as part of a virtual platform definition in addition to t... » read more

Emerging Apps And Challenges For Packaging
By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

HDL Simulation Acceleration Solution For Microchip FPGA Designs
By Aldec - 23 Nov, 2020 - Comments: 0

Mission-critical FPGA designs for space and radar applications continue to increase in complexity, such that they require a comprehensive and robust verification environment. There are hardware-in-the-loop solutions in the market that utilize FPGA boards, but when it comes to establishing functional coverage and debugging the custom logic, users would typically need to go back to HDL simulation... » read more

Power/Performance Bits: Nov. 23
By Jesse Allen - 23 Nov, 2020 - Comments: 0

Graphene energy Researchers from the University of Arkansas, University of Pennsylvania, and Universidad Carlos III de Madrid built a circuit capable of capturing graphene's thermal motion and converting it into an electrical current. "An energy-harvesting circuit based on graphene could be incorporated into a chip to provide clean, limitless, low-voltage power for small devices or sensors,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Nov, 2020 - Comments: 0

Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Nov, 2020 - Comments: 0

Synopsys acquired Light Tec, a provider of optical scattering measurements and measurement equipment. The company also provides optical engineering consulting services plus training for use of Synopsys' lighting simulation software. "Light Tec's proven optical measurement capabilities provide our customers with robust new tools for high-accuracy optical product simulations and visualizations," ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 20 Nov, 2020 - Comments: 0

Pervasive computing — Data centers, cloud, 5G, edge In a move to improve data collection for IC manufacturing, PDF Solutions entered a definitive agreement to acquire Cimetrix Incorporated. Cimetrix makes connectivity products for smart manufacturing, which PDF Solutions will use in its Exensio product to facilitate moving IC manufacturing data from the factory floor to cloud-based analytics... » read more

Upturn Seen For Silicon Wafer Market
By Mark LaPedus - 19 Nov, 2020 - Comments: 0

After a downturn in 2019, the silicon wafer market is expected to rebound in 2020. 2021 looks even better for silicon wafers. Silicon wafers are a fundamental part of the semiconductor business. Every chipmaker needs to buy them in one size or another. Silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. The silicon wafer ma... » read more

The Ten Commandments Of Packaging
By Sam Sadri - 19 Nov, 2020 - Comments: 0

Semiconductor packaging continues to evolve as chipmakers find new ways to fit more functionality into smaller spaces. Whereas the package once served primarily as a means of attaching a chip to a circuit board and protecting it from damage due to heat, moisture, etc., packaging today plays an important role in adding value to the device, boosting customization while helping to reduce costs. ... » read more

EUV Challenges And Unknowns At 3nm and Below
By Mark LaPedus - 19 Nov, 2020 - Comments: 1

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

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