Taking Advantage Of Outsourced Test Services

By Vineet Pancholi - 19 Nov, 2020 - Comments: 0

The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon and Google are prime success stories that have advanced the industry with business-enabling services. These economic productivity improvement services allow their customers to focus on product architecture, design and quick time to market. The service p... » read more

Bonding Issues For Multi-Chip Packages

By Katherine Derbyshire - 19 Nov, 2020 - Comments: 1

The rising cost and complexity of developing chips at the most advanced nodes is forcing many chipmakers to begin breaking up that chip into multiple parts, not all of which require leading edge nodes. The challenge is how to put those disaggregated pieces back together. When a complex system is integrated monolithically — on a single piece of silicon — the final product is a compromise ... » read more

From FinFETs To Gate-All-Around

By Nerissa Draeger - 19 Nov, 2020 - Comments: 0

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As compared to prior planar transistors, the fin, contacted on three sides by the gate, provides much better control of the channel formed within the fin. But, finFETs are already reaching the end of their utility as... » read more

Smart Manufacturing In Fabs

By Jean-Marc Philippe - 19 Nov, 2020 - Comments: 0

Not long after STMicroelectronics opened its first semiconductor plant in Singapore more than 50 years ago, a facility chiefly focused on chip assembly and packaging, the company realized that it had constructed the site in an area with a blossoming chip ecosystem with a bright future. Before long, the company became the first to start a wafer fab facility in the so-called Little Red Dot. To... » read more

What’s Next In AI, Chips And Masks

By Mark LaPedus - 19 Nov, 2020 - Comments: 0

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to talk about AI and Moore’s Law, lithography, and photomask technologies. What follows are excerpts of that conversation. SE: In the eBeam Initiative’s recent Luminary Survey, the participants had some interesting observations about the outlook for the photomask market. What were those observations? Fujimur... » read more

A Study Of Wiggling AA Modeling And Its Impact On Device Performance In Advanced DRAM

By Coventor - 18 Nov, 2020 - Comments: 0

In this paper, a wiggling active area (fin) in an advanced 1x DRAM process was analyzed and modeled using the pattern-dependent etch simulation capabilities of the SEMulator3D semiconductor modeling software. Nonuniformity in sidewall passivation caused by hard mask pattern density loading was identified as the root cause of the wiggling profile. The calibrated model mimicked these phenomena, g... » read more

IC Integrity Of Edge-Computing Processors: Meeting The Demands Of AI

By Rob van Blommestein - 18 Nov, 2020 - Comments: 0

If you ask most people, they would say that we’re living in an age of artificial intelligence (AI). But the reality is that we’re just getting started. The age of artificial intelligence is still in its infancy. So many of aspects of our lives involve technology but we’re still having to feed that technology or manually operate that technology in order get the results we want. Autonomous ... » read more

FinFETs Give Way To Gate-All-Around

By Lam Research - 18 Nov, 2020 - Comments: 0

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

By Amkor - 18 Nov, 2020 - Comments: 0

Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

Establishing A Special Interest Group On Common Hardware Weaknesses

By Jason Oberg - 18 Nov, 2020 - Comments: 0

It seems like almost every week yet another hardware security vulnerability is announced. Just last week a team of researchers disclosed a new attack called “Platypus”, an acronym for "Power Leakage Attacks: Targeting Your Protected User Secrets.” This is another attack exploiting the simple fact that hardware sits below the conventional security abstractions and finding a vulnerability i... » read more

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