UPF 1.0, UPF 2.0, UPF 2.1, UPF 3.0, And Now UPF 3.1
By Mentor, a Siemens Business - 13 May, 2020 - Comments: 0

UPF is the fastest evolving IEEE standard, and UPF 3.1 is a major milestone in its evolution. This paper provides an in-depth analysis and relevant examples of all the new features introduced in UPF 3.1 along with semantic differences with earlier versions. It also highlights migration challenges to help users migrate from existing power formats to UPF 3.1. To read more, click here. » read more

Powering The Edge
By Arm - 13 May, 2020 - Comments: 0

On-device machine learning (ML) is a phenomenon that has exploded in popularity. Smart devices that are able to make independent decisions, acting on locally generated data, are hailed as the future of compute for consumer devices: on-device processing slashes latency; increases reliability and safety; boosts privacy and security...all while saving on power and cost. Although ML in edge d... » read more

Design Of An Ultra-Low-Power Current Steering DAC In A Modern SOI technology
By Fraunhofer IIS/EAS - 13 May, 2020 - Comments: 0

Despite the tremendous advancement in innovations on digitizing and processing signals over the last century, real world signals are inevitably analog in nature. A digital-to-analog converter (DAC) serves in translating these digitized signals into different analog quantities like voltage, current or charges. We mainly focus on a Nyquist-rate current-steering digital- to-analog converte... » read more

Blog Review: May 13
By Jesse Allen - 13 May, 2020 - Comments: 0

Mentor's Neil Johnson considers when in a project certain verification methods should be deployed and the relative impact of techniques at a given point in subsystem design. Cadence's Paul McLellan looks back at the development of mobile standards with 2G, GSM, and the transition to all-digital transmission. Synopsys' Taylor Armerding highlights five online courses to boost your software ... » read more

BiST Vs. In-Circuit Sensors
By SE Staff - 13 May, 2020 - Comments: 0

Monitoring the health of a chip post-manufacturing, including how it is aging and performing over time, is becoming much more important as ICs make their way into safety-critical applications such as the central brain in automobiles. Faced with longer lifespans and a growing body of functional safety rules, systems vendors need to be able to predict when a part will fail. But as sensing auto... » read more

DDR5: The Next-Generation Technology For High Performance Computing
By Synopsys - 13 May, 2020 - Comments: 1

The rapid growth in real-time data requirements for cloud services, IoT, high-performance servers and workstations, hyperscale data centers and big data has increased pressure on memory suppliers to improve memory density and speed. This pressure has resulted in a need for new memory technology that goes beyond the current DDR4 limit of 16 Gb single die capacity and speed of 3200MT/s. Click ... » read more

Multiphysics Simulations For Power Management ICs
By Ansys - 13 May, 2020 - Comments: 0

This application brief describes Ansys Totem’s multiphysics capabilities to help you analyze power, thermal and reliability challenges in highly complex power management ICs (PMIC devices). You will understand why Totem’s many features including full-chip capacity, flexible GUI and layout-driven simulation and debug capabilities make it the ideal platform for identifying design issues. From... » read more

Sensors, Data And Machine Learning
By Ed Sperling - 12 May, 2020 - Comments: 0

Strategies for building reliability into chips and systems are beginning to shift as more sensors are added into these devices and machine learning is applied to that data. In the past, system monitoring relied heavily on MEMS devices for things like acceleration, temperature and positioning (gyroscopes). While those devices are still important, in the past couple years there has been an exp... » read more

New Uses For Manufacturing Data
By Ed Sperling - 12 May, 2020 - Comments: 0

The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

Sensing Automotive IC Failures
By Anne Meixner - 12 May, 2020 - Comments: 1

The sooner you detect a failure in any electronic system, the sooner you can act. Together, data analytics and on-chip sensors are poised to boost quality in auto chips and add a growing level of predictive maintenance for vehicles. The ballooning number of chips cars makes it difficult to reach 10 defective parts per billion for every IC that goes into a car.  And requiring that for a 15-y... » read more

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