AUTOSAR-Aligned Analysis Of 180 SoC Vulnerabilities In Auto Architecture (Chalmers, Univ. of Gothenburg)


A new technical paper titled "An AUTOSAR-Aligned Architectural Study of Vulnerabilities in Automotive SoC Software" was published by researchers at Chalmers University of Technology and University of Gothenburg. Abstract "Cooperative, Connected and Automated Mobility (CCAM) are complex cyber-physical systems (CPS) that integrate computation, communication, and control in safety-critical env... » read more

Ebook: The Impact of AI On Data Center Design


AI is reshaping the data center industry. Rising power demands, advanced cooling needs, and digital twin technology are redefining how facilities are designed and operated. Download our free ebook on AI-optimized data centers to learn: How AI workloads are driving massive increases in power and cooling requirements Why liquid cooling is becoming essential for AI infrastructure ... » read more

Blog Review: Oct. 29


Siemens' Ujjwal Negi and Prashant Dixit warn that while UCIe 3.0 improves performance and efficiency through higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, those enhancements also increase verification complexity. Cadence's Anika Sunda suggests that a unified digital thread that connects verification environ... » read more

Ensuring Reliability Becomes Harder In Multi-Die Assemblies


Multi-die assemblies are bringing together a variety of materials and processes with distinctly different physical properties, creating significant challenges in manufacturing and packaging that can impact yield at time zero and reliability in the field. What passes electrical screening at the end of the line may look good on paper, but these devices can still fail once exposed to rapid and ... » read more

Developing RISC-V Compute Subsystems


As demand grows for scalable, efficient, and customized compute, more companies are turning to RISC-V as the preferred architecture for high-performance computing. Tenstorrent and Baya Systems have designed a compute subsystem combining IP from both companies designed to enable AI and HPC use cases. The solution leverages Tenstorrent’s Ascalon processor and Baya’s advanced interconnect tech... » read more

An Overview Of Recent Progress On The EUV + DSA Strategy (Univ. of Chicago, Berkeley Lab, Argonne)


A new technical paper titled "Directed self-assembly of block copolymers for high-precision patterning in the era of extreme ultraviolet lithography" was published by researchers at University of Chicago, Lawrence Berkeley National Laboratory and Argonne National Laboratory. Abstract "Extreme ultraviolet (EUV) lithography enables unprecedented resolution in semiconductor patterning but face... » read more

Multimodal LLM Assistant for Chip Physical Design (National Taiwan Univ., UCLA, NVIDIA)


A new technical paper titled "Multimodal Chip Physical Design Engineer Assistant" was published by researchers at National Taiwan University, University of California, Los Angeles and NVIDIA Research. Abstract "Modern chip physical design relies heavily on Electronic Design Automation (EDA) tools, which often struggle to provide interpretable feedback or actionable guidance for improving ro... » read more

Chip Industry Technical Paper Roundup: Oct. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=486 /] Find more semiconductor research papers here. » read more

Research Bits: Oct. 28


Mushroom memristors Researchers from The Ohio State University found that common edible mushrooms can be grown and trained to act as organic memristors. The team cultured samples of shiitake and button mushrooms, dehydrated them once mature to ensure long-term viability, connected them to special electronic circuits, and then electrocuted them at various voltages and frequencies. “Myce... » read more

Critical Factors For Storing Data In DRAM


DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, bandwidth, and capacity were the primary considerations. But as the amount of data that needs to be processed, moved, and stored continues to rise, a whole new set of factors is emerging. Steven Woo, fellow and distinguished inventor at Rambus, talks about latency under load,... » read more

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