Vertically integrated hybrid large area electronics platform; 3D-IC thermal simulation; photonics for sustainable AI; AI efficiency in data centers; inner gate length modulation of MFMIS NSFETs; column-based read disturbance in DRAM; microarchitectural defense against EM side-channel attack.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Three-dimensional integrated hybrid complementary circuits for large-area electronics | KAUST, Imperial College London, University of Manchester |
| DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design | Intel Corporation, University of California Santa Barbara, Cadence |
| Photonics for sustainable AI | Boston University, NY CREATES, Lightmatter, Cornell Tech |
| Improving AI Efficiency in Data Centres by Power Dynamic Response | University of Cambridge, Nyobolt Limited, Nanyang Technological University |
| Inner Gate Length Modulation of MFMIS Nanosheet FET Memory for Advanced Technology Nodes | Samsung, Seoul National University |
| ColumnDisturb: Understanding Column-based Read Disturbance in Real DRAM Chips and Implications for Future Systems | ETH Zurich, CISPA |
| ShuffleV: A Microarchitectural Defense Strategy against Electromagnetic Side-Channel Attacks in Microprocessors | Northeastern University, Binghamton University |
Find more semiconductor research papers here.
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