Thermal Challenges In Advanced Packaging
By Ed Sperling - 02 Dec, 2019 - Comments: 2

CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Using FPGAs For AI
By Brian Bailey - 02 Dec, 2019 - Comments: 3

Artificial intelligence (AI) and machine learning (ML) are progressing at a rate that is outstripping Moore's Law. In fact, they now are evolving faster than silicon can be designed. The industry is looking at all possibilities to provide devices that have the necessary accuracy and performance, as well as a power budget that can be sustained. FPGAs are promising, but they also have some sig... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Nov, 2019 - Comments: 0

Packaging and test TrendForce has released its top-10 OSAT rankings in terms of sales for the third quarter of 2019. ASE was in first place in the rankings, followed by Amkor and JCET. “According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales stead... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Nov, 2019 - Comments: 0

Aldec launched the HES-MPF500-M2S150 Development Kit for early co-development and co-verification of hardware and software for FPGA-based embedded systems that will use devices from either or both of Microchip’s PolarFire or SmartFusion2 families. The HES-MPF500-M2S150 Development Kit features Microchip’s low power PolarFire MPF500T FCG1152 FPGA, which has 481k logic elements, 1480 math blo... » read more

Week In Review: IoT, Security, Autos
By SE Staff - 29 Nov, 2019 - Comments: 0

Internet of Things Amazon is expanding its IoT services. Alexa Voice Services will require less processing power on the device, moving from the 100MB of RAM and Arm Cortex A microprocessor to 1MB and an Arm Cortex-M. Amazon will do more of the processing in the cloud, enabling developers to add Alexa to smaller, single purpose devices. “It just opens up the what we call the real ambient inte... » read more

Blog Review: Nov. 27
By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

Making And Protecting Advanced Masks
By Mark LaPedus - 27 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Thomas Scheruebl, director of strategic business development and product strategy at Zeiss; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What fol... » read more

Verification Pilgrims Show A Historical Case For DFT
By Lee Vick - 27 Nov, 2019 - Comments: 0

The Mayflower Steps, where the Pilgrims are believed to have embarked on their journey to America, are located in the beautiful Barbican area of Plymouth, a small town in the southwest of England. As the lone American working for Moortec, a British company based in Plymouth, I stood and stared at them this past September. Separated by a few yards of distance but 399 years of history I found my... » read more

Designing In 4D
By Ed Sperling - 26 Nov, 2019 - Comments: 0

The chip design world is no longer flat or static, and increasingly it's no longer standardized. Until 16/14nm, most design engineers viewed the world in two dimensions. Circuits were laid out along x and y axes, and everything was packed in between those two borders. The biggest problems were that nothing printed as neatly as the blueprint suggested, and current leaked out of two-dimension... » read more

Better, Not Best
By Brian Bailey - 26 Nov, 2019 - Comments: 0

The semiconductor industry has been lulled into a particular way of thinking by Moore's Law. It is like the age-old joke — you don't have to outrun a bear, you only have to be faster than your companion. The same has held true for designs. There is little to no point being the best, you only have to be good enough to be better than the competition. That sets the bar. Best is also relative.... » read more

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