category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Using New Technologies On Smaller Wafers
By David Haynes - 20 Feb, 2020 - Comments: 0

The industry is no longer held captive by sales from computing applications, such as personal computers, servers or even cellular phones and tablets. A diverse range of markets are contributing to growth seen by Lam and our customers. Cloud storage, machine learning or artificial intelligence (AI), virtual reality (VR) and augmented reality (AR), robotics, medical and automotive, including the ... » read more

Manufacturing Bits: Feb. 18
By Mark LaPedus - 18 Feb, 2020 - Comments: 0

Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more

Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era
By Amkor - 17 Feb, 2020 - Comments: 0

The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Feb, 2020 - Comments: 0

Chipmakers and OEMs IC Insights has released its rankings of the 25 largest wafer capacity leaders in terms of monthly installed capacity in 200mm-equivalents as of December 2019. Samsung was in first place, followed by TSMC, Micron, SK Hynix, and Kioxia, formerly Toshiba Memory, according to IC Insights. Combined capacity of the top five companies represented 53% of total global wafer capa... » read more

Manufacturing Bits: Feb. 10
By Mark LaPedus - 10 Feb, 2020 - Comments: 0

Accelerating and cooling muons Using a novel particle accelerator, a group for the first time have observed a phenomenon called muon ionization cooling–an event that could give researchers a better understanding of matter and the universe. Muons are obscure sub-atomic particles. This experiment could pave the way towards the development of new and powerful muon particle accelerators. Thes... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Feb, 2020 - Comments: 0

Fab tools Citing the outbreak of the coronavirus in China, SEMI has postponed Semicon/FPD China 2020 and related events originally scheduled for March 18-20, 2020. For the same reason, SEMI will no longer host Semicon Korea 2020 in Seoul, South Korea, February 5-7, as originally scheduled. ------------------------------- Veeco has introduced the new Lumina Metal Organic Chemical Vapor De... » read more

Manufacturing Bits: Feb. 4
By Mark LaPedus - 04 Feb, 2020 - Comments: 0

Non-targeted analysis Using a technology called machine learning, the Southwest Research Institute has introduced a software tool that detects known and unknown chemical components in food, air and drugs. It detects compounds in products we are exposed to every day using both machine learning and metrology techniques. A subset of artificial intelligence (AI), machine learning uses advanced ... » read more

Identifying DRAM Failures Caused By Leakage Current And Parasitic Capacitance
By Taeyeon Oh - 03 Feb, 2020 - Comments: 0

Leakage current has been a leading cause of device failure in DRAM design, starting with the 20nm technology node. Problems with leakage current in DRAM design can lead to reliability issues, even when there are no obvious structural abnormalities in the underlying device. Leakage current has become a critically important component in DRAM device design. Fig. 1 (a) DRAM Memory Cell, (b) GI... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jan, 2020 - Comments: 0

Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

Manufacturing Bits: Jan. 28
By Mark LaPedus - 28 Jan, 2020 - Comments: 0

Fast photography The California Institute of Technology has developed a high-speed camera that can take pictures of transparent objects. The technology, called phase-sensitive compressed ultrafast photography (pCUP), can take up to 1 trillion pictures per second of transparent objects. Potentially, the technology from Caltech could be used in several applications, such as taking photos of s... » read more

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