Week In Review: Design, Low Power


M&A Intel acquired NetSpeed Systems, a network-on-a-chip and interconnect fabric IP and tool provider. Founded in 2011, the San Jose-based company recently put a focus on interconnects designed with AI applications in mind. Intel has cast the acquisition as a way to tie a number of its other technologies together. The team will join Intel's Silicon Engineering Group. Intel has been a NetSp... » read more

Week in Review: IoT, Security, Auto


Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

AI’s Long-Term Impact


Artificial intelligence technology will have a significant impact on the world’s economy in the months and years ahead, the McKinsey Global Institute forecasts in a new report. Certain companies and some countries will greatly benefit in the new era of AI, leaving others behind, the business and economics research arm of McKinsey & Co. predicts. The key takeaway points of the report: ... » read more

Blog Review: Sept. 12


Cadence's Paul McLellan checks out the impact the Meltdown, Spectre, and Foreshadow vulnerabilities will have on future processor design with an overview of speculative execution and why it's important to current architectures. Mentor's Matthew Ballance suggests some ways to find existing information and descriptions that can be used to jump-start the creation of portable stimulus models. ... » read more

Intel Buys NetSpeed for NoC, Fabric IP


Intel acquired NetSpeed Systems, taking in network-on-a-chip and interconnect fabric intellectual property for designing, developing, and testing system-on-a-chip devices. The acquisition gives Intel a key missing ingredient in its plan to develop customized heterogeneous solutions for its customers. The company now has various memory pieces, interconnect bridges, programmable logic and ASIC... » read more

Week In Review: Manufacturing, Test


Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

Week In Review: Design, Low Power


Cadence teamed up with nine PCB manufacturing partners on an ecosystem to provide easier access to partners' technology files to improve PCB manufacturability. The program, DesignTrue DFM, allows for automated import of a manufacturer's latest DFM rules as well as rule checking in real time as part of the PCB layout process. The nine initial PCB manufactures supporting the program are: Bay Area... » read more

Week in Review: IoT, Security, Auto


Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

Blog Review: Sept. 5


Synopsys' Taylor Armerding looks at a case of exploding costs – up to $17 million – when the city of Atlanta, Georgia fell victim to the SamSam ransomware, plus the lessons other cities can take to improve their security. Cadence's Paul McLellan traces how a landmark moment in object recognition, the ImageNet database, has spurred increasingly better object recognition algorithms for alm... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries said that it is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. To be sure, it was a tough decision by GF to put 7nm on hold. But generally, analysts believe that GF made the right decision. “There’s only a handful of semiconductor companies that will require high-volume 7nm technology right when... » read more

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