Manufacturing Bits: Aug. 6


Printing Ears Engineered cartilage is an option for auricular reconstruction. Enabling the development of engineered cartilage, Massachusetts General Hospital has fabricated a bioartificial ear using a 3D printer technology. The ear looks and mechanically behaves like a human one. Researchers used a titanium wire framework within a composite collagen ear-shaped scaffold to maintain the dime... » read more

The Week In Review: Aug 5


By Mark LaPedus According to a nationwide online survey conducted by Harris Interactive on behalf of Crucial.com, 36% of those Americans who experienced PC problems in the past six months admit they have lashed out at their slow, underperforming computers by using profanity, screaming and shouting, or by striking it with a fist or other object. Those who experienced computer problems also indi... » read more

Blog Review: July 31


By Ed Sperling Wherever you turn in IC design, there’s always someone talking about future problems involving the interconnect. Cadence’s Brian Fuller puts the latest speech by North Carolina State professor Paul Franzon in historical perspective—or at least in the shadow of the last dire prediction by Intel’s Mark Bohr two decades ago. Incidentally, Bohr’s warning turned out to be r... » read more

System Bits: July 30


Controlling nanomaterials To find out why some sets of flat nanocrystals arrange themselves in an alternating, herringbone style even though it wasn’t the simplest pattern, University of Pennsylvania researchers turned to experts in computer simulation at the University of Michigan and the Massachusetts Institute of Technology. The result of the collaboration gives nanotechnology research... » read more

The Week In Review: July 26


By Ed Sperling Cadence’s Q2 revenue increased 11% to $362 million compared to $326 million in the same period in 2012. On a GAAP basis, net income dropped to $9 million compared with $36 million in 2012, but that decrease was impacted by the cost of recent acquisitions and integration of companies. On a non-GAAP basis, income was $61 million compared with $53 million in Q2 2012. Dassault... » read more

Blog Review: July 24


By Ed Sperling Mentor’s Harry Foster unleashes part six of the Wilson Research Group functional verification study, this segment digging deeper into the time spent in verification. The numbers have surpassed time spent on the design side, which either means the front-end tools are getting better or the verification problem is becoming more difficult. Cadence’s Brian Fuller interviews I... » read more

Power/Performance Bits: July 23


Thinnest light absorber Expected to potentially reduce the cost and improve the efficiency of solar cells, Stanford University scientists report they have created the thinnest, most efficient absorber of visible light on record. The nanoscale structure is thousands of times thinner than an ordinary sheet of paper. The researchers said achieving complete absorption of visible light with a mi... » read more

System Bits: July 23


Bottom-up nanoribbons Concentric hexagons of graphene grown in a furnace at Rice University represent the first time anyone has synthesized graphene nanoribbons on metal from the bottom up — atom by atom. As seen under a microscope, the layers brought onions to mind, according to Rice chemist James Tour, until a colleague suggested flat graphene could never be like an onion. “So I said,... » read more

Manufacturing Bits: July 23


Space Tubes In 2011, NASA produced a material that absorbs on average more than 99% of the ultraviolet, visible, infrared, and far-infrared light that hits it. NASA’s so-called “super-black” material is based on a thin layer of multi-walled carbon nanotubes. Tiny gaps between the nanotubes collect and trap light. The carbon absorbs the photons, preventing them from reflecting off surf... » read more

The Week In Review: July 22


By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

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