category: Research

category: Auto, Security & Edge AI

Manufacturing Bits: Sept. 8
By Mark LaPedus - 08 Sep, 2021 - Comments: 0

Calibrating a microphone The National Institute of Standards and Technology (NIST) has developed a faster and more accurate way to calibrate a microphone. NIST’s new calibration technique makes use of lasers, a promising technology that could supplant today’s methods. The technology could one day be used to calibrate sensitive microphones in factories, power plants and other settings li... » read more

Power/Performance Bits: Sept. 8
By Jesse Allen - 08 Sep, 2021 - Comments: 0

Backscatter radios for 5G Researchers at the Georgia Institute of Technology, Nokia Bell Labs, and Heriot-Watt University propose using backscatter radios to support high-throughput communication and 5G-speed Gb/sec data transfer using only a single transistor. “Our breakthrough is being able to communicate over 5G/millimeter-wave (mmWave) frequencies without actually having a full mmWave... » read more

Manufacturing Bits: Aug. 31
By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

Power/Performance Bits: Aug. 31
By Jesse Allen - 31 Aug, 2021 - Comments: 0

Securing memory Researchers at Columbia University suggest several ways to make computing more secure without imposing a system performance penalty. The efforts focus on memory security, specifically pointers. "Memory safety has been a problem for nearly 40 years and numerous solutions have been proposed. We believe that memory safety continues to be a problem because it does not distribute... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Power/Performance Bits: Aug. 24
By Jesse Allen - 24 Aug, 2021 - Comments: 0

Low power AI Engineers at the Swiss Center for Electronics and Microtechnology (CSEM) designed an SoC for edge AI applications that can run on solar power or a small battery. The SoC consists of an ASIC chip with RISC-V processor developed at CSEM along with two tightly coupled machine-learning accelerators: one for face detection, for example, and one for classification. The first is a bin... » read more

Manufacturing Bits: Aug. 17
By Mark LaPedus - 17 Aug, 2021 - Comments: 0

Scaling qubits Australia is a hotbed of R&D activity, especially in the field of quantum computing. For example, the University of New South Wales (UNSW) in Australia has demonstrated a possible way to control millions of qubits in a silicon quantum chip. Researchers from UNSW Sydney have devised a new three-dimensional dielectric resonator, a technology that could deliver controlled... » read more

Power/Performance Bits: Aug. 17
By Jesse Allen - 17 Aug, 2021 - Comments: 0

Digital fiber Researchers at MIT, Harrisburg University of Science and Technology, and Rhode Island School of Design developed a digital fiber that can sense, store, analyze, and infer activity after being sewn into a shirt. "This work presents the first realization of a fabric with the ability to store and process data digitally, adding a new information content dimension to textiles and a... » read more

Manufacturing Bits: Aug. 9
By Mark LaPedus - 09 Aug, 2021 - Comments: 1

Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

Power/Performance Bits: Aug. 9
By Jesse Allen - 09 Aug, 2021 - Comments: 0

Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

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