category: Top Stories

category: Auto, Security & Edge AI

Nvidia To Buy Arm For $40B
By Ed Sperling - 13 Sep, 2020 - Comments: 2

Nvidia inked a deal with Softbank to buy Arm for $40 billion, combining the No. 1 AI/ML GPU maker with the No. 1 processor IP company. Assuming the deal wins regulatory approval, the combination of these two companies will create a powerhouse in the AI/ML world. Nvidia's GPUs are the go-to platform for training algorithms, while Arm has a broad portfolio of AI/ML processor cores. Arm also ha... » read more

Is DVFS Worth The Effort?
By Brian Bailey - 10 Sep, 2020 - Comments: 2

Almost all designs have become power-aware and are being forced to consider every power saving technique, but not all of them are yielding the expected results. Moreover, they can add significant complexity into designs, increasing the time it takes to get to tapeout and boosting up the cost. Dynamic voltage and frequency scaling (DVFS) is one such power and energy saving technique now being... » read more

Dealing With Device Aging At Advanced Nodes
By Ann Mutschler - 10 Sep, 2020 - Comments: 0

Premature aging of circuits is becoming troublesome at advanced nodes, where it increasingly is complicated by new market demands, more stress from heat, and tighter tolerances due to increased density and thinner dielectrics. In the past, aging and stress largely were separate challenges. Those lines are starting to blur for a number of reasons. Among them: In automotive, advanced-node... » read more

Compiling And Optimizing Neural Nets
By Bryon Moyer - 10 Sep, 2020 - Comments: 0

Edge inference engines often run a slimmed-down real-time engine that interprets a neural-network model, invoking kernels as it goes. But higher performance can be achieved by pre-compiling the model and running it directly, with no interpretation — as long as the use case permits it. At compile time, optimizations are possible that wouldn’t be available if interpreting. By quantizing au... » read more

Wireless Power Market Heats Up
By Bryon Moyer - 26 Aug, 2020 - Comments: 2

The wireless power market is in flux as established technologies meet newer approaches. Old standards battles have simmered somewhat, but competing messages remain. What the public ends up using will depend heavily on public charging infrastructure, but the stakes are significant. The market for battery chargers is forecast to reach $25B by 2022. Most of those chargers plug into the wall, bu... » read more

What Happened To Execute-in-Place?
By Bryon Moyer - 25 Aug, 2020 - Comments: 0

Executing code directly from non-volatile memory, where it is stored, greatly simplifies compute architectures — especially for simple embedded devices like microcontrollers (MCUs). However, the divergence of memory and logic processes has made that nearly impossible today. The term “execute-in-place,” or ”XIP,” originated with the embedded NOR memory in MCUs that made XIP viable. ... » read more

Monitoring Chips After Manufacturing
By Brian Bailey - 19 Aug, 2020 - Comments: 2

New regulations and variability of advanced process nodes are forcing chip designers to insert additional capabilities in silicon to help with comprehension, debug, analytics, safety, security, and design optimization. The impact of this will be far-reaching as the industry discusses what capabilities can be shared between these divergent tasks, the amount of silicon area to dedicate to it, ... » read more

Redefining The Power Delivery Network
By Brian Bailey - 13 Aug, 2020 - Comments: 3

Reliably getting power around a package containing multiple dies, potentially coming from multiple sources, or implemented in diverse technologies, is becoming much more difficult. The tools and needed to do this in an optimized manner are not all there today. Nevertheless, the industry is confident that we can get there. For a single die, the problem has evolved slowly over time. "For a ... » read more

Preparing For A Barrage Of Physical Effects
By Ann Mutschler - 13 Aug, 2020 - Comments: 0

Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

Power And Performance Optimization At 7/5/3nm
By Ed Sperling - 13 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

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