category: Top Stories

category: Auto, Security & Edge AI

Architecting For Efficiency
By Ann Mutschler - 10 Apr, 2014 - Comments: 0

By definition, to be efficient is to perform or function in the best possible manner with the least waste of time and effort; having and using requisite knowledge, skill, and industry. As this relates to SoC design today, achieving the highest level of efficiency is a challenge with many dimensions. Efficiency comes in multiple ways. “One dimension would be power consumption,” said Oz Le... » read more

Power Moves Up To First Place
By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

Executive Insight: Simon Davidmann
By Brian Bailey - 10 Apr, 2014 - Comments: 0

Every industry has some colorful characters and within the EDA industry, Simon Davidmann is certainly one that comes to mind. For the past 30-something years, Davidmann has provided guidance to the industry, stood up for what he believes in, been an inspiration to many entrepreneurs, and had some fun along the way. Simon is a serial entrepreneur, angel investor and he has been a key person invo... » read more

The New Face Of MCUs
By Ann Mutschler - 10 Apr, 2014 - Comments: 0

For years, the humble microcontroller was known as the workhorse of white goods and other embedded applications that required some amount of processing, but not as much as a microprocessor would provide. Much has changed since then. Today’s MCUs are the star components in fast-growing and increasingly sophisticated application areas such as automotive, smartphones and the Internet of Thing... » read more

Pain Management
By Ed Sperling - 10 Apr, 2014 - Comments: 0

In part one of this series, the focus was on overlapping and new pain points in the semiconductor flow, from initial conception of what needs to be in a chip all the way through to manufacturing. Part two looks at how companies are attempting to manage that pain. It’s no secret that [getkc id="81" kc_name="SoC"]s are getting more complicated to design, debug and build, but the complexity i... » read more

High Level Synthesis: Significant Differences Remain
By Brian Bailey - 09 Apr, 2014 - Comments: 1

In part 1 of this experts series on high-level synthesis (HLS), Semiconductor Engineering sat down with Mike Meredith, vice president of technical marketing at Cadence/Forte Design Systems; Mark Warren, Solutions Group director at Cadence; Thomas Bollaert, vice president of application engineering at Calypto; and Devadas Varma, senior director at Xilinx. The initial part of the discussion looke... » read more

Micro-Power Energy Harvesting
By Ernest Worthman - 07 Apr, 2014 - Comments: 3

Since the beginning of the human race’s self-awareness, people have strived to harness the planet’s free energy sources; wind, solar, thermal and hydro. On a macro scale, man’s dreams have come to fruition. The next frontier is capturing energy on a micro scale. On the macro front, there are massive corridors of energy powered by wind and solar developments, which generate megawatts of... » read more

More Pain In More Places
By Ed Sperling - 14 Mar, 2014 - Comments: 2

Pain is nothing new in to the semiconductor industry. In fact, the pain of getting complex designs completed on budget, and finding the bugs in those designs, has been responsible for decades of continuous growth in EDA, IP, test, packaging, and foundries. But going forward there is change afoot in every segment of the flow from architecture to design to layout to verification to manufacturi... » read more

The Next Bigger Things
By Ed Sperling - 13 Mar, 2014 - Comments: 0

When the Internet of Things really started making headlines several years ago—the concept had been around since at least the early 1990s—the assumption was that most of the semiconductors involved in sensing and communicating would be simple, highly limited, and developed using older technology. As the concept evolves and grows, however, it’s beginning to take on a whole new texture. R... » read more

IoT Creates New IP Requirements
By Ann Mutschler - 13 Mar, 2014 - Comments: 2

With the rise of smart cities, cars and houses, an enhanced connectivity infrastructure bolstered by an increasingly connected culture, the Internet of Things (IoT) represents an exciting opportunity for semiconductor industry players. As such, market researchers at IDC expect the installed base of the Internet of Things will be approximately 212 billion "things" globally by the end of 2020 ... » read more

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