category: Top Stories

category: Auto, Security & Edge AI

Upcoming Hurdles For The Semiconductor Industry
By Ann Mutschler - 01 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys-Apache; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael... » read more

Heterogeneous Multi-Core Headaches
By Ed Sperling - 28 Jan, 2016 - Comments: 4

Cache coherency is becoming more pervasive—and more problematic—as the number of heterogeneous cores used in designs continues to rise. Cache coherency is an extension of caching, which has been around since the 1970s. The notion of a cache has a long history of being utilized to speed up a computer's main memory without adding expensive new components. Cache coherency's introduction coi... » read more

Using Agile Methods For Hardware
By Ann Mutschler - 28 Jan, 2016 - Comments: 11

[getkc id="182" kc_name=agile development"] methodology for software is getting a much closer look by hardware teams these days, because what used to work in SoC design and verification isn't working nearly as well with rising complexity. Development processes need to be constantly evolved to determine how to be more productive, deliver higher quality, cut costs in development, and how to g... » read more

Predictions For 2016: Tools and Flows
By Brian Bailey - 28 Jan, 2016 - Comments: 0

Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Are Chips Getting More Reliable?
By Ed Sperling - 28 Jan, 2016 - Comments: 4

Reliability is emerging as a key metric in the semiconductor industry, alongside of power, performance and cost, but it also is becoming harder to measure and increasingly difficult to achieve. Most large semiconductor companies look at reliability in connection with consumer devices that last several years before they are replaced, but a big push into automotive, medical and industrial elec... » read more

Debug: Last Bastion Of Automation
By Brian Bailey - 27 Jan, 2016 - Comments: 0

There have been a number of times when anecdotal evidence became folk law and then over time, the effort was put in to find out whether there was any truth in it. Perhaps the most famous case is the statement that verification consumes 70% of development time and resources. For years this “fact” was used in almost every verification presentation and yet nobody knew where the number had come... » read more

Inside Neuromorphic Computing
By Mark LaPedus - 25 Jan, 2016 - Comments: 2

Semiconductor Engineering sat down to talk about neuromorphic technology with Guy Paillet, chief executive of General Vision. The fabless IC design house is a pioneer and supplier of neuromorphic chips. What follows are excerpts of that conversation. SE: In 1993, you invented and co-patented a neural networking chip with IBM. Then, you joined General Vision in 1999. Briefly tell us about Gen... » read more

Neuromorphic Chip Biz Heats Up
By Mark LaPedus - 21 Jan, 2016 - Comments: 0

It’s no secret that today’s computers are struggling to keep up with the enormous demands of data processing and bandwidth, and the whole electronics industry is searching for new ways to enable that. The traditional approach is to continue to push the limits of today’s systems and chips. Another way is to go down the non-traditional route, including an old idea that is generating stea... » read more

Why Use A Package?
By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

5nm Fab Challenges
By Mark LaPedus - 21 Jan, 2016 - Comments: 2

At a recent event, Intel presented a paper that generated sparks and fueled speculation regarding the future direction of the leading-edge IC industry. The company described a next-generation transistor called the nanowire FET, which is a finFET turned on its side with a gate wrapped around it. Intel’s nanowire FET, sometimes called a gate-all-around FET, is said to meet the device require... » read more

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