category: Top Stories

category: Auto, Security & Edge AI

Boosting Yield With Layout Awareness
By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ann Steffora Mutschler Yield. Just the word can make many engineers cringe and hide in their cubicles—especially with manufacturing problems and excessive power during test increasing causing failures. But the combination of physical data with diagnostics engines may be the light at the end of the tunnel, allowing for easier pinpointing of defects. There are many reasons why a chip fai... » read more

The Interconnect Game
By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ed Sperling Having a single bus protocol is something most SoC engineers can only dream about. Reality is often a jumble of protocols determined by the IP they use, which can slow down a design’s progress. The problem stems largely from re-use and legacy IP. While it might be convenient to use only on an AXI standard protocol from ARM, most chips are a combination of IP tied to specif... » read more

Betting On Subsystems
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ed Sperling One of the consistent trends among successful companies, particularly in well-established industries, is that over time labor becomes specialized. No one can do everything well, and the more complex the systems the more pieces have to be outsourced. This creates immediate benefits for companies putting together the overall systems. They can focus on designs and doing what the... » read more

2.5D Leverages Existing Tools On The Way To 3D
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ann Steffora Mutschler As design and manufacturing issues with true 3D design continue to be worked out, interim 2.5D technologies are moving ahead as engineering teams leverage this packaging-driven approach to manage heat, cost, area and yield. Technologies such as Wide I/O memory support 2.5D, and when combined with logic they allow engineering teams to realize a performance increase,... » read more

New Processes Define New Power Plans
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Pallab Chatterjee FinFETs, stacked die, heterogeneous interposers, TSVs, 450mm wafers, new interconnects and everything with MEMs and sensors is what the last few weeks have brought. A number of major announcements, technology releases, conference updates have identified these technologies as the future of IC design. At ISQED, Robert Geer, chief academic officer at the College of Nanosca... » read more

Reliability Concerns Grow
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ed Sperling Knowing when to signoff on an IC design has always been as much art as science, matching engineering experience with managed risk. As ICs become more complex, however, even the most advanced chip companies are getting things wrong. Some of this can be fixed through software and some of it can be tweaked with programmable firmware. But some of it may have to be fixed in the ne... » read more

Power, Applications Drive New Thinking On System Planning
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ann Steffora Mutschler Throwing out the term ‘application-driven power-aware design methodology’ may sound like gobbledygook to some, but this concept is keeping many technologists awake at night—especially considering video games that heat iPads to 100+ degrees centigrade (near melting). The problem is very real, and potentially painful in more ways than one. The iPad example, al... » read more

Getting Ready For Stacked Die
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ed Sperling The move toward stacking of die has always been a series of disconnected pieces and vague promises for the future, but in the past few months the scenario has changed radically—and so has the commentary. All three of the Big Three EDA vendors now have at least some of the pieces in place for 2.5D stacking and are working on a full 3D flow. Two of the biggest FPGA vendors, A... » read more

Intel Turns Up Heat in Silicon Foundry Business
By Ed Sperling - 04 Apr, 2012 - Comments: 0

By Mark LaPedus Intel Corp. continues to make waves in the foundry arena. The chip giant has recently announced three new and major customers within its embryonic foundry business. Some speculate there are more customers on the horizon, reportedly including a rumored on-and-off again foundry deal with Apple Inc. At this point, Intel is a niche player in the foundry business, as the compan... » read more

New Entrants Seek Niches in NAND Flash Fray
By Ed Sperling - 03 Apr, 2012 - Comments: 0

By Mark LaPedus For some time, the NAND flash market has been primarily dominated by five vendors: Micron, Samsung, SanDisk, SK Hynix and Toshiba. Other vendors have been seeking to get a foothold in the exploding market — with little or no luck. Intel Corp. and Powerchip Semiconductor Corp. have separately experienced limited success in NAND. And Elpida Memory Inc. and Spansion Inc. are... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy