category: Whitepapers

category: IoT, Security & Automotive

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 13 Apr, 2022 - Comments: 0

By Martin James, Gary Dick, and Arif Khan, Cadence with Suhas Pai and Brian Rea, Intel The Compute Express Link™ (CXL™) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, ... » read more

A Full-GaN Solution For High Power Density Chargers And Adapters
By Infineon - 13 Apr, 2022 - Comments: 0

Due to continuous demand for high power density, USB-C fast chargers’ switching frequencies need to be increased to reduce the size of the transformers and the filter components. Emerging technologies based on Wide Band Gap (WBG) semiconductor materials enable new approaches to increase power density. At high switching frequencies, GaN HEMTs for synchronous rectifier (SR) switches have the ad... » read more

Automation Of Shared Bus Memory Test With Tessent MemoryBIST
By Siemens EDA - 12 Apr, 2022 - Comments: 0

New requirements in automotive, artificial intelligence (AI), and processor applications have resulted in increased use of memory-heavy IP. Memory-heavy IPs for these applications are optimized for high performance, and they will often have a single access point for testing the memories. Tessent MemoryBIST provides an out-of-the-box solution for using this single access point, or shared bus int... » read more

Case Study — 3D Wire Bond Inspection and Metrology
By CyberOptics - 12 Apr, 2022 - Comments: 0

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Extracting Intrinsic Mechanical Properties Of Thin Low-Dielectric Constant Materials With iTF Analysis
By Bruker - 12 Apr, 2022 - Comments: 0

This white paper focuses on the optimization and use of Bruker’s iTF software package for the extraction of intrinsic (substrate independent) mechanical properties, particularly for thin, low-k materials. These considerations are split into two main parts: Measurement procedure (Section II) and iTF execution (Section III). The former outlines important aspects of acquiring proper experimental... » read more

Made in the Cloud!
By Synopsys - 12 Apr, 2022 - Comments: 0

While software developers have been building and delivering software in the cloud for many years now, how much IC hardware is “made in the cloud”? We’re here to help you understand the case for IC hardware development in the cloud and answer the most common questions. Download the paper and learn: Why isn’t everybody doing it? Why cloud? Why now? Can you afford to ignore i... » read more

Verification Management For Aerospace And Defense
By Siemens EDA - 07 Apr, 2022 - Comments: 0

This executive brief presents the verification management digital thread. It demonstrates the value of integrated verification and certification for accelerating product delivery in the aerospace and defense industry. Read the brief to learn how you can certify products on schedule and within budget, eliminating the silos in your verification and certification activities. Aircraft certificat... » read more

3 Steps To Capturing Effective Hardware Security Requirements
By Tortuga Logic - 06 Apr, 2022 - Comments: 0

As hardware vulnerabilities continue to rise, it’s increasingly crucial for those developing semiconductors to reduce consumer and business risk by establishing comprehensive security programs. These should include a systematic process for developing security requirements, verifying them at scale throughout the design process, and producing final documentation for security signoff before tape... » read more

Preventing A $500 Attack Destroying Your IoT Devices
By Rambus - 06 Apr, 2022 - Comments: 0

Internet of Things (IoT) smart devices numbering in the billions and connected via the internet are increasingly vital to society and the global economy. However, the very “connectedness” that makes IoT devices so valuable can be turned to an enormous liability if these devices are left unprotected from security-related threats. This paper explores the threat environment faced by, and the c... » read more

Efficient Data Transfer With High-Speed Serial Flash Interface IP
By Synopsys - 06 Apr, 2022 - Comments: 0

Technology advancement and increasing data transfer rate, have made serial flash memories widely popular to store data on off-chip locations. Traditionally, flash memory devices use a primary controller to interface with the CPU and get the data from the memory device. For large amounts of data, the communication with the CPU is mostly performed by the external Direct Memory Access (DMA) contro... » read more

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