category: Whitepapers

category: IoT, Security & Automotive

Open RAN Direct RF Sampling Radio Transceiver Architectures For Massive MIMO
By AMD - 02 Mar, 2022 - Comments: 0

With the exponential increase in wireless traffic, mobile networks are transformed into more software-driven, virtualized, flexible, intelligent, and energy efficient systems. These trends have stimulated significant change in the core network with the advent of software defined networks (SDN) and network functions virtualization (NFV), which have enabled building more agile and less expensive ... » read more

Addressing Library Characterization And Verification Challenges Using ML
By Siemens EDA - 23 Feb, 2022 - Comments: 0

At advanced process nodes, Liberty or library (.lib) requirements are more demanding due to design complexities, increased number of corners required for timing signoff, and the need for statistical variation modeling. This results in an increase in size, complexity, and the number of .lib characterizations. Validation and verification of these complex and large .lib files is a challenging task... » read more

Achieving C-V2X Compliance
By Keysight - 23 Feb, 2022 - Comments: 0

Testing the performance of cellular vehicle-to-everything (C-V2X) components and subsystems to achieve compliance against evolving 5G test requirements is an ongoing challenge for the connected vehicle market. The global acceptance for the C-V2X technology takes autonomous driving from a shared vision to mass-market reality. C-V2X uses the 3rd Partner Project (3GPP) standard for 4G and 5G mo... » read more

Fuzz Testing Software-Defined Vehicles Using Agent Instrumentation
By Synopsys - 23 Feb, 2022 - Comments: 0

Cybersecurity has become intertwined into each step of the automotive development process. In particular, fuzz testing has proven to be a powerful approach to detect unknown vulnerabilities in automotive systems. But with limited instrumentation, especially on software-heavy systems such as high-performance computers (HPCs), several types of issues go undetected, including memory leaks and case... » read more

RF To mmWave Design For Systems
By Cadence - 23 Feb, 2022 - Comments: 0

RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

Image Processing For Vision AI
By Renesas - 23 Feb, 2022 - Comments: 0

Recent years have seen an increasing need for Vision AI applications using AI to enable real-time image recognition. Vision AI, which substitutes AI for human visual recognition, requires optimal image processing. Renesas has released RZ/V2M as mid-class, and RZ/V2L as an entry class, Vision AI microprocessors (MPUs). Both products are equipped with DRP-AI which is Dynamically Reconfigurable Pr... » read more

Warpage Of Compression Molded SiP Strips
By JCET - 17 Feb, 2022 - Comments: 0

By Eric Ouyang, Yonghyuk Jeong, JaeMyong Kim, JaePil Kim, OhYoung Kwon, and Michael Liu of JCET; and Susan Lin, Jenn An Wang, Anthony Yang, and Eric Yang of CoreTech System (Moldex3D). Abstract System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing p... » read more

Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP
By Amkor - 17 Feb, 2022 - Comments: 0

Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to its advantages of good package design flexibility, controllable package warpage at room temperature (25°C) and high temperature (260°C), reduced assembly manufacturing cycle time and chip-last asse... » read more

A Sub-1 Hz Resonance Frequency Resonator Enabled By Multi-Step Tuning For Micro-Seismometer
By Coventor - 17 Feb, 2022 - Comments: 0

We propose a sub-1 Hz resonance frequency MEMS resonator that can be used for seismometers. The low resonance frequency is achieved by an electrically tunable spring with an ultra-small spring constant. Generally, it is difficult to electrically fine-tune the resonance frequency at a near-zero spring constant because the frequency shift per voltage will diverge at the limit of zero spring const... » read more

Technology Advancements For Dynamic Function eXchange In Vivado ML Edition
By Xilinx - 11 Feb, 2022 - Comments: 0

As systems become more complex and designers are asked to do more with less, adaptability is a critical asset. While Xilinx FPGAs and SoCs always provided the flexibility to perform on-site device reprogramming, current constraints including increased cost, tighter board space, and power consumption demand even more efficient design strategies. Xilinx Dynamic Function eXchange (DFX) extends the... » read more

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