category: Whitepapers

category: IoT, Security & Automotive

STMicroelectronics Methodology And Process For Heterogeneous Automotive Package Design
By Siemens EDA - 06 Oct, 2021 - Comments: 0

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to... » read more

Using Machine Learning For Characterizations Of NoC Components
By Arteris - 06 Oct, 2021 - Comments: 0

Modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized. At this stage a NoC component is a soft module, described by a set of architectural parameters, like the bit width of... » read more

HBM3 Memory: Break Through To Greater Bandwidth
By Rambus - 06 Oct, 2021 - Comments: 0

AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new hei... » read more

Building A Secured Internet Of Things
By Infineon - 06 Oct, 2021 - Comments: 0

The emerging Internet of Things (IoT) presents tremendous opportunities for innovative companies to deliver products and services to make industry more efficient, transportation safer and the everyday lives of people more convenient and fulfilling. But with great good there also can be great risk. Remote, intelligent monitoring and control for factories, homes, cities, and cars can increase eff... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

The 5 Essential Elements Of A Successful Software Security Initiative
By Synopsys - 06 Oct, 2021 - Comments: 0

Every organization that develops or integrates software needs a software security initiative—a blend of people, processes and tools that ensures applications and the data they process are secure. As customers, regulators, executives and boards of directors start asking for evidence of a formal approach to software security, organizations are trying to determine where to start, how to construc... » read more

Inverse lithography technology: 30 years from concept to practical, full-chip reality
By Technical Paper Link - 01 Oct, 2021 - Comments: 0

Published in the Journal of Micro/Nanopatterning, Materials, and Metrology, Aug. 31, 2021. Read the full technical paper here (open access). Abstract In lithography, optical proximity and process bias/effects need to be corrected to achieve the best wafer print. Efforts to correct for these effects started with a simple bias, adding a hammer head in line-ends to prevent line-end shortening. T... » read more

Automated ESD Protection Verification For 2.5D And 3D ICs
By Siemens EDA - 22 Sep, 2021 - Comments: 0

While automated flows for ESD protection verification are well-established for 2D ICs, 2.5D and 3D designs present new challenges in both ESD circuit design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs. Ensuring correct and consistent ESD protection in 2.5/3D ICs raises the reliability and product life... » read more

Thermal And Stress Analysis Of 3D-ICs With Celsius Thermal Solver
By Cadence - 22 Sep, 2021 - Comments: 0

As electronics get smaller and faster, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can appear in the chip, the board, the package, and the entire system. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius  Thermal Solver helps designers analyz... » read more

RISC-V Processor Verification: Case Study
By Imperas - 22 Sep, 2021 - Comments: 0

Abstract: The open RISC-V instruction set architecture is gaining traction with both semiconductor vendors and systems companies. A key question is how to verify the RISC-V processor implementation, especially when developing the RTL and/or adding custom instructions? This paper reports on the techniques used and lessons learned for the verification of a RV64IMACBNSU RISC-V processor by an exp... » read more

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