category: Whitepapers

category: IoT, Security & Automotive

AnastASICA — Towards Structured and Automated Analog/Mixed-Signal IC Design For Automotive Electronics
By Fraunhofer IIS/EAS - 12 May, 2021 - Comments: 0

In our world based on electronics, the design of analog/mixed-signal (AMS) ICs is still mainly done manually. While digital design benefits from complete synthesis flows, analog lags far behind in terms of development time, cost, and risk. Analog design flows are hardly standardized and necessitate the four eye principle as important quality tool. Thus, highly experienced designers who incorpor... » read more

Designing Secure and Trusted Silicon Using Shift-Left in Verification
By Synopsys - 12 May, 2021 - Comments: 0

Designing secure silicon requires the design to be stable at all times, it shouldn't enter unknown states at any time to make it vulnerable from the security point of view. This paper identifies different sources of instability such as combinational feedback loop, unguarded clock and reset crossing, unguarded power crossing, etc. These instabilities can lead to unknown value propagation and hig... » read more

Kria K26 SOM: The Ideal Platform For Vision AI At The Edge
By Xilinx - 12 May, 2021 - Comments: 0

With various advancements in artificial intelligence (AI) and machine learning (ML) algorithms, many high-compute applications are now getting deployed on edge devices. So, there is a need for an efficient hardware that can execute complex algorithms efficiently as well as adapt to rapid enhancements in this technology. Xilinx's Kria K26 SOM is designed to address the requirements of executing ... » read more

MIPI Drives Performance for Next-Generation Displays
By Mixel - 12 May, 2021 - Comments: 0

In late 2000, Nokia announced its iconic 3310 handset which featured an 84×48-pixel pure monochrome display. Seven years later, Apple unveiled its first iPhone with a 90mm (3.5”) screen and 320×480-pixel resolution (at 163 ppi). Cameras and high-quality displays quickly became the de-facto standard for smartphones by the mid-2000s. However, proprietary interface solutions for connecting cam... » read more

Recommendations And Solutions For USB-C PD Chargers
By Infineon - 12 May, 2021 - Comments: 0

The recent enhancements and technology advancements in the charger domain have made engineers face new challenges in their daily lives. Higher efficiency, smaller footprint with the same output power, or more power in the same footprint are among the key challenges in contemporary charger designs. In this whitepaper, Infineon provides engineers with an overview of different solutions in the USB... » read more

Study On High-Performance Computing Usage For Engineering Simulation
By Ansys - 12 May, 2021 - Comments: 0

Simulation will play a critical role in the development of new market disrupting technology, from autonomous vehicles to 5G cellular networks, and the need for on-premises or cloud-based HPC resources to support those efforts is only going to increase. This white paper explores: How companies are using HPC-based simulation. The effect of the COVID-19 pandemic on HPC usage and adoptio... » read more

Acoustic Metrology for Fine Pitch Microbumps in 3D IC
By Onto Innovation - 11 May, 2021 - Comments: 0

The continuing shift to 3D integration requires formation of electrical interconnects between multiple vertically stacked Si devices to enable high speed, high bandwidth connections. Microbumps and through silicon vias (TSVs) enable the high-density interconnects for die-to-die and die-to-wafer stacking for different applications. In this paper, we present acoustic metrology techniques for the ... » read more

FPGA Prototyping: Supersizing Scale And Performance
By Synopsys - 11 May, 2021 - Comments: 0

Given the cost of re-spinning a system-on-chip (SoC), semiconductor companies have always looked for ways to verify and validate the SoC before tape-out. Prototyping using field programmable gate arrays (FPGAs) became a key methodology as part of this pre-silicon verification and validation effort. Click here to read more. » read more

A Novel Memory Test System With An Electromagnet For STT-MRAM Testing
By Advantest - 11 May, 2021 - Comments: 0

We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm2 in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electroma... » read more

Monitor And Control Automotive Devices With Over-The-Air Updates
By Siemens EDA - 05 May, 2021 - Comments: 0

Modern vehicles are complex electronic devices that require regular over-the-air (OTA) system and software updates to ensure their correct and safe operation. This paper discusses the need for OTA and the Siemens solutions that ensure OTA updates are secure and meet all regulations and standards. To read more, click here. » read more

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