category: Whitepapers

category: IoT, Security & Automotive

Defect Mitigation And Characterization In Silicon Hardmask Materials
By Brewer Science - 17 Mar, 2021 - Comments: 0

From SPIE Digital Library: In this study, metal contaminants, liquid particle count and on-wafer defects of Si- HMs and filtration removal rates are monitored to determine the effect of filter type, pore size, media morphology, and cleanliness on filtration performance. 5-nm PTFE NTD2 filter having proprietary surface treatment used in this study shows lowest defect count. Authors: Vineet... » read more

Chip Board Interaction Analysis Of 22nm FD-SOI Technology In WLP
By Amkor - 17 Mar, 2021 - Comments: 0

Recently, Wafer Level Packaging (WLP) has been in high demand, especially in mobile device applications as a path to enable miniaturization while maintaining good electrical performance. The relatively inexpensive package cost and simplified supply chain are encouraging other industries to adapt WLP capabilities for radio frequency (RF), communications/sensing (mmWave) and automotive applicatio... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing
By eBeam Initiative - 17 Mar, 2021 - Comments: 0

The Survey: 2021 Deep Learning Applications List by eBeam Initiative members is a list of current deep learning efforts that are being used in photomask to wafer semiconductor manufacturing. Examples come from ASML, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, Siemens Industries Software, Inc., Siemens EDA, STMicroelectronics, and TASMIT. Published by the eBeam Initiative Membe... » read more

Nine Effective Features Of NVMe Verification IP For PCIe-Based SSD Storage
By Siemens EDA - 10 Mar, 2021 - Comments: 0

Non-Volatile Memory Express (NVMe) is a new software interface optimized for PCIe Solid State Drives (SSD). This paper provides an overview of the NVMe specification and examines some of its key features. We will discuss its pros and cons, compare it to other conventional technologies, and point out key areas to focus on during its verification. You will learn how NVMe Questa Verification IP... » read more

Designing ASIPs With Confidence
By Synopsys - 10 Mar, 2021 - Comments: 0

Well-designed ASIPs with a strong SDK combine C/C++ programmability with the power and performance of dedicated hardware. Product families based on ASIP platforms are often highly flexible, capable of addressing multiple market segments with the same silicon and handling updates in the field. They lean well towards software-driven verification with few penalties for late product requirement cha... » read more

Multiband Active Antenna Tuner For Cellular IoT Applications
By Cadence - 10 Mar, 2021 - Comments: 0

This white paper discusses related design challenges and solutions for developing a multiband active antenna tuner for cellular internet of things (IoT) massive machine-type communications (mMTC) applications. Click here to read more. » read more

A Layered Approach To High Performance Device Virtualization
By Arm - 10 Mar, 2021 - Comments: 0

The complexity and performance requirements of computing systems have been growing and demands are further driven by applications, such as ML and the everything-connected world of IoT with many billions of connected devices. Arm has developed a virtualization and accelerator strategy to address this, which we discuss in this white paper from our Architecture and Technology Group A layered... » read more

Development Of Digital Controlled Technology For High Voltage DC Testing
By Advantest - 09 Mar, 2021 - Comments: 0

In recent years, the demand for low power devices has increased due to issues related to global environmental protection. As a result, the demand for high-voltage power devices has also increased. To test such devices, test equipment that can handle high-voltage devices (hereinafter referred to as “test equipment”) is required. In addition, test time must be shortened to reduce manufacturin... » read more

Controlling TC SAW Filter Frequency with Picosecond Ultrasonics
By Onto Innovation - 09 Mar, 2021 - Comments: 0

Presented during the poster session at ASMC 2019 PULSE™ technology is a first principles based acoustic metrology technique that is capable of measuring various parameters of interest in semiconductor manufacturing such as multi-layered metal thickness, sound velocity of dielectric films and reflectivity. In this paper, we demonstrate the applications of PULSE technology in the TC-SAW... » read more

Fast Cycle Approximate Simulation Using ARC nSIM NCAM
By Synopsys - 09 Mar, 2021 - Comments: 0

One of the key factors of successful software (e.g. firmware/application) development is the ability to quickly run and profile software in the absence of target hardware. The earlier in the design process that this is possible, the better, i.e. during the pre-silicon phase. Typically, the pre-silicon phase is dominated by three activities, each with different challenges: Exploring the Ha... » read more

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