Gate Drive Solutions For CoolGaN 600 V HEMTs


This paper explains the gate drive requirements for Infineon’s CoolGaN 600 V e-mode HEMTs. Various driving solutions are discussed, ranging from the standard RC-coupled driver to a new differential drive concept utilizing dedicated gate driver ICs. In half-bridge topologies, a hybrid configuration combining isolated and non-isolated drivers could be an exciting alternative. Practical applicat... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff


System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more

Bringing Reset And Power Domains Together


The Unified Power format (UPF) standard enables designers to add power intent for a design. For power management, designers typically partition a design into power domains. Interactions between these power domains are done through various power control logic, like retention logic, isolation logic, and level shifters. Designers need to validate that the power control logic does not introduce new... » read more

MIPI Drives Performance For Next-Generation Displays


MIPI Alliance technology has helped enable the dramatic growth of the mobile phone market. The function and capabilities of MIPI interface solutions have grown dramatically as well. MIPI DSI-2 has become the leading display interface across a growing range of products including smartphones, AR/VR, IoT appliances, and ADAS/autonomous vehicles. As the application space has expanded, so too have t... » read more

When Failure Is Not An Option: Improving Medical Device Reliability


Medical electronics are expected to operate safely over extended periods of time to provide monitoring, therapeutic or life-sustaining functions for patients. Without built-in reliability, these devices could experience failures or malfunctions that greatly increase the possibility of infection or death. In the movie Apollo 13, NASA’s Gene Kranz (played by actor Ed Harris) made the phrase “... » read more

Dynamic Fault Injection Into Digital Twins Of Safety-Critical Systems


In this work we present a technology for dynamically introducing fault structures into digital twins without the need to change the virtual prototype model. The injection is done at the beginning of a simulation by dynamically rewiring the involved netlists. During the simulation on a real-time platform, faults can be activated or deactivated triggered by sequences, statistical effects or by ev... » read more

Optimize Physical Verification Cost Of Ownership With Elastic CPU Management


For physical verification, advanced process technology nodes create implementation challenges. Design sizes have gotten larger and required rules from foundries have become more numerous in count (thousands) and more complex (hundreds of discrete steps). For these reasons, physical verification tools have been able to span these jobs not only across multiple CPUs on a single physical compute ho... » read more

Achieving CDC Signoff On Multi Billion Gate Designs With Hierarchical CDC Flow


For the last few decades, the System-on-Chip (SoC) design size has dramatically increased and more complexity has been introduced to deliver the desired functionality. A typical SoC can have many complex IPs operating at different clock frequencies, which can stress the verification cycle. Generally, design and verification teams are spending an increasing amount of time to ensure that the SoC ... » read more

Development Of High Voltage General-Purpose Pin-Electronics


Currently, there is a demand in Automated Test Equipment (ATE) to test both high-speed/low-voltage amplitude devices manufactured in advanced processes and low-speed / high-voltage amplitude devices manufactured in legacy processes by a pin-electronics equipment. However, it is difficult to achieve both the operating speed over than 1Gbps and the wide I/O range over than 10Vpp, due to the trade... » read more

Advanced mm-Wave And Terahertz Measurements With Cascade Probe Stations


The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

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