Mentor's Chairman and CEO sounds off about where the IC design challenges are, what needs to be done to fix them, and what new opportunities will unfold.
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System-Level Design talks with Mentor Graphics, Cadence, and an Accellera member about what's changing in verification--and where the missing pieces are.
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System-Level Design digs into the future of the design automation tools industry and the Design Automation Conference with Cadence's Neil Hand, Atrenta's Mike Gianfagna and Springsoft's Johnson Teng.
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System-Level Design talks with Bob Bluth of the Naval Postgraduate School about UAV design and debug challenges--and what's inside of these devices. (The blue and green cellophane tape seal some of the access points prior to delivery--and the directions).
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Gary Patton, VP at IBM's semiconductor R&D Center, talks with System-Level Design about the challenges of developing chips all the way down to 15nm.
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Simon Segars, ARM's executive vice president and general manager of the company's physical IP group, talks about the war with Intel and which markets it's likely to affect.
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One-On-One with IDT CEO Ted Tewskbury: How IDT is bridging the analog and digital engineering worlds with a mixed-signal team approach.
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Pixim's CEO talks about what the company outsources, what it keeps internal, and how it differentiates from the competition.
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Synopsys CEO Aart De Geus sounds off about the future of design and where growth will come from in the EDA market.
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A look at what's driving Cadence's new EDA 360 strategy, the problem areas in EDA and why the company decided to buy Denali.
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Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.
Computex shows AI ecosystem; fully autonomous chip design; Intel targets AI racks; Nikon's 1.5 micron L/S litho; IC market rises; Apple's chiplet era; 4,500 chips per AI server rack; HBM price hikes; quantum IPO, chip and roadmap; SiC guidelines; MXenes; EV outlook; autonomous edge chiplets.
InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics, co-packaged optics, optical circuit switch).
Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.
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