GenAI for analog; water immersion cooling; 2D materials roadmap; stochastic computing ReRAM; sub-10nm nanogap; pre-silicon HW trojans; C2RAM on FDSOI; cache coherence traffic for NoC routing; HW IP protection.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Generative AI for Analog Integrated Circuit Design: Methodologies and Applications | McMaster University |
| The 2D Materials Roadmap | Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. |
| Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling | University of Illinois, Urbana, University of Arkansas and UC Berkeley |
| All-in-Memory Stochastic Computing using ReRAM | TU Dresden, Center for Scalable Data Analytics and Artificial Intelligence (ScaDS.AI), Case Western Reserve University, University of Louisiana at Lafayette and Barkhausen Institut |
| A progressive wafer scale approach for Sub-10 nm nanogap structures | Seoul National University, Chung-Ang University, Mohammed VI Polytechnic University and Ulsan National Institute of Science and Technology |
| A Survey on the Design, Detection, and Prevention of Pre-Silicon Hardware Trojans | Sandia National Laboratories |
| An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures | Forschungszentrum Jülich, RWTH Aachen University and SOITEC |
| Learning Cache Coherence Traffic for NoC Routing Design | Nanyang Technological University |
| HIPR: Hardware IP Protection through Low-Overhead Fine-Grain Redaction | University of Florida |
Find more semiconductor research papers here.
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