SiC packaging; functional test sequences; 6G and beyond; verification for NVM; thwarting ML/algorithmic structural attacks; 3D PICs; excitonic phenomena In TMDs; neural networks.
New technical papers recently added to Semiconductor Engineering’s library.
| Technical Paper | Research Organizations |
|---|---|
| Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging | Cambridge University |
| Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing | University of Illinois Urbana-Champaign (UIUC) |
| Functional Compaction for Functional Test Sequences | Purdue University |
| Flip-Lock: A Flip-Flop-Based Logic Locking Technique for Thwarting ML-based and Algorithmic Structural Attacks | TU Dresden and Ruhr University Bochum |
| Dynamical Control of Excitons in Atomically Thin Semiconductors | Harvard University, Google Research, Stanford University, UC Riverside and others |
| 6G: The Intelligent Network of Everything —A Comprehensive Vision, Survey, and Tutorial | Finland’s University of Oulu |
| iMIV: in-Memory Integrity Verification for NVM | Intel Labs and Indian Institute of Science (IISc) |
| Hardware implementation of backpropagation using progressive gradient descent for in situ training of multilayer neural networks | Eindhoven University of Technology |
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