UCIe-3D; LLMs for EDA, HW design; reprogrammable light-based processor; distributed batteries 3D IC; processing-using-DRAM; power side-channel attacks; memristors based on resistive switching; all-optical computing.
New technical papers recently added to Semiconductor Engineering’s library.
Technical Paper | Research Organizations |
---|---|
Hardware Phi-1.5B: A Large Language Model Encodes Hardware Domain Specific Knowledge | Kansas State University and others |
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express | Intel |
Programmable high-dimensional Hamiltonian in a photonic waveguide array | RMIT University and others |
On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits | University of Florida and Brookhaven National Lab |
Functionally-Complete Boolean Logic in Real DRAM Chips: Experimental Characterization and Analysis | ETH Zurich |
Hardware/Software Cooperative Design Against Power Side-Channel Attacks on IoT Device | Tokyo Institute of Technology and the University of Electro-Communications |
Thermal Compact Modeling and Resistive Switching Analysis in Titanium Oxide-Based Memristors | Universidad de Granada, Leibniz-Institut für innovative Mikroelektronik, Universidad Politécnicade Madrid, University of Twente, KAUST, and Universitat de Barcelona |
An All-Optical General-Purpose CPU and Optical Computer Architecture | Akhetonics |
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