Chip Industry Technical Paper Roundup: Oct. 8

Low-power electronics roadmap; preventing Rowhammer via memory allocation; 2D FETs strain engineering; neuromorphic HW virtualization; non-volatile resistive switching; ambipolar Schottky-based ferroelectric design; tunnel FETs.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Roadmap on low-power electronics Rice University, UC Berkeley, Georgia Tech, TSMC, Intel, Harvard, et al.
Preventing Rowhammer Exploits via Low-Cost Domain-Aware Memory Allocation Georgia Tech
Strain engineering in 2D FETs: Physics, status, and prospects UC Santa Barbara
Multiscale Simulation and Machine Learning Facilitated Design of Two-Dimensional Nanomaterials-Based Tunnel Field-Effect Transistors: A Review University of Chicago and Argonne National Lab
NeuroVM: Dynamic Neuromorphic Hardware Virtualization Stanford University, UT Austin and Temsa Research & Development Center
Non-Volatile Resistive Switching in Nanoscaled Elemental Tellurium by Vapor Transport Deposition on Gold Politecnico di Milano, UT Austin, and STMicroelectronics
On the Potential of Ambipolar Schottky-Based Ferroelectric Transistor Designs for Enhanced Memory Windows in Scaled Devices Global TCAD Solutions, Igor Sikorsky Kyiv Polytechnic Institute, INSA Lyon, and NaMLab

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