GAA FETs; thermal simulation in 3D-IC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs; photonics: GaSb/SiN tunable hybrid integrated laser; domain wall-magnetic tunnel junction analog content addressable memory.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| ReTrustFSM: Toward RTL Hardware Obfuscation-A Hybrid FSM Approach | University of Florida |
| Photonics: GaSb/SiN Tunable Hybrid Integrated Laser | Tampere University |
| Exploring Topological Semi-Metals for Interconnects | Penn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC) |
| DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design | UCSB and Cadence |
| A Review of the Gate-All-Around Nanosheet FET Process Opportunities | IBM Research Albany |
| Integrated silicon photonic MEMS | EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute |
| Mechanical overtone frequency combs | Delft University of Technology, Ahmedabad University and NIST |
| Towards Hardware-Based Application Fingerprinting with Microarchitectural Signals for Zero Trust Environments | Air Force Institute of Technology |
| Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data | UT Austin and Samsung Advanced Institute of Technology (SAIT) |
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