Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.
This is the first in a series of articles tracking government chip investments. See part two for Americas-focused funding and part three for the UK and EMEA.
Countries around the world are ramping up investments into their semiconductor industries as part of new or existing approaches. The increased government activity stems from growing awareness of the strategic importance of the chip sector, a desire to avoid a repeat of pandemic-era supply chain issues, and heightened geopolitical tensions, particularly between the U.S. and China. (See below for a table of significant government initiatives.)
Government support takes many forms, including cash injections, subsidies, tax breaks, loans, regulatory easement, advisories, and more. In some cases, each action is part of a broader national plan. In other cases, assistance seems to appear on an ad hoc basis.
For example:
“We are seeing unprecedented attention from Europe, Japan, Korea, other places — a recognition that the semiconductor industry is critical for national economic security, not only in the United States, but for themselves and globally,” said a senior U.S. Department of Commerce (DoC) official, speaking on condition of anonymity. “There’s a shared interest in making sure that this industry is vibrant, but also secure and resilient. We are seeing trends of more government involvement and interest in proposals to attract investments in places where they have not had fabs, or major fabs, such as India and other places. But that’s actually not new. That has been around for several years, if not decades, to try to attempt. There are structural and market reasons why that has not yet happened, but we’re noticing a renewed effort.”
Others agree that government funding is having a significant positive impact on regions throughout the global semiconductor ecosystem.
“Both the United States and Europe are looking to become a more prominent source of manufacturing after years of offshoring,” said Todd Younkin, president and CEO of Semiconductor Research Corp. (SRC). [Younkin is also a member of the Chips Act Industrial Advisory Committee, but in this interview was not speaking on behalf of the committee.] “The U.S. is looking at the CHIPS Act to bolster its domestic production and is making good inroads there. Europe is looking to do the same, to double their manufacturing capabilities in the EU and reduce their reliance on other regions. The EU has made some great progress. GlobalFoundries (GF), ASM, and ASML are doing well. The joint venture between TSMC, Bosch, Infineon, and NXP is going well. The EU recently received some bad news, with Intel’s delay of its Magdeburg, Germany facility by two years. However, Intel remains committed to the German facility in time. Spain has a new partnership with imec, and the Iberian Peninsula is gaining some exciting capabilities in packaging with the strategic cooperation between GF and Amkor.”
U.S. and EU progress is mirrored by similar initiatives across Asia.
“In East Asia, Japan, Taiwan and South Korea are trying to figure out what they do really well, and how they can continue to be number one in those areas,” said Younkin. “They are using those strengths to round out their partnerships and reduce their own resilience on other nations. To me, it’s exciting to see TSMC go to Japan, and to see Japan’s higher ambitions for microelectronics, because both nations are an important part of the materials, equipment, and consumer goods landscape.”
One of the key outcomes of the recent spate of government investment is that manufacturing facilities are being built in countries outside of the traditional centers, where countries like Malaysia and Vietnam offering themselves as neutral territory in a bid to win a portion of the enormous global capital expenditure.
“If you look at the capital expenditures of this industry, it is top heavy in terms of both companies that are spending the funds, as well as countries that are receiving those funds, to build out these projects,” said the Commerce official. “The top five companies in terms of CapEx – Intel, TSMC, Samsung, Micron, SK hynix – account for somewhere between 50% and 70% of the of the industry’s CapEx, which ranges somewhere between $130 billion and $160 billion depending on the cyclical nature of the industry. So these companies can dictate where things are built, for the most part. They have traditionally been built in the places where fabs already exist, and there is this inertia to continue to build in these countries, because once you build a fab, then an ecosystem exists around it to make it easier for you to build the next fab. If you want to take a regional approach as to where the CapEx is being spent, then you can add up the United States, Europe, Japan, Korea, Taiwan and China, and they would account for most of the world. There’s some concentration within Europe, as well, with a lot of spending in Germany. And there’s traditionally fabs in places like Italy, but other countries in Europe are interested in expanding. Economies of scales matter, and that’s why it’s so exciting for us to see the CHIPS Act announcements. The economies of scale as well as increased CapEx that we are expecting in the United States is unlike anything we’ve seen in the past few decades. And this is opening up a sea change in the strength of the U.S. ecosystem, but we expect that to benefit the entire world, not just the United States.”
The CHIPS for America program office has a global outlook with a dedicated International Engagements Team. The office also coordinates very closely with other government agencies that have a stake in CHIPS funding, including the U.S. Department of State, which runs the $500 million International Technology Security and Innovation (ITSI) Fund aiming to deepen ties with allies. For example, the State recently partnered with India and Mexico.
Others agree that countries can mutually benefit from the wave of global investments, and that strength comes from interdependence.
“The momentum around the U.S. CHIPS Act is building very well,” said Ajit Manocha, president and CEO of SEMI. “We held SEMICON West in July and had a record number of attendees, and the same goes for SEMICON around the world. The motivation is coming because companies see the growth and opportunities in the industry, and they see that governments are very actively participating in the growth. At SEMICON West, we had about 70 or 80 people from multiple state governments and the federal government – Department of Commerce and State Department – because there’s a lot of interest that the onshoring is happening in U.S. Similarly, onshoring is happening in Europe. Japan and South Korea are very active. India is next in line to be very active. So the momentum is very, very positive, and the government schemes are working around the world.”
National security
U.S.-China geopolitical tension remains a concern as countries forge alliances based on export controls of equipment and critical materials. Overall, there is acceptance that China is a major player in the global supply chain, but security is paramount.
“Countries have to resolve these kinds of issues bilaterally, and if they cannot be resolved bilaterally, the like-minded countries need to get involved,” said Manocha. “At this stage, we are heavily dependent on each other. We need to treat each other as competitors, but not as enemies. The most important thing is that every country must play a fair game. Every country must comply to the international laws for IP protection, national security, cyber security, even economic security. SEMI does not get involved in the politics or with politicians. We only focus on policies, and the policies should be such that they should not create disruptions for the industry. But you cannot compromise on the principles of security.”
Both SEMI’s Manocha and the Commerce Department official agree that end-to-end supply chain self-sufficiency is not the goal for any single country. The global semiconductor industry will remain interconnected for the foreseeable future as regions continue to specialize in certain parts of the supply chain, whether that be test, assembly, manufacturing, packaging, or design.
“The good news is that the way the industry is growing to $1 trillion, it is not only the bleeding-edge technology at 5nm or 2nm,” said SEMI’s Manocha. “There is growth across the board, including the legacy technologies, which are mostly based in Asian countries. If you take the smartphone, maybe 20% of the chips are advanced technologies for GPUs and so on. But 80% are chips that are not on advanced technologies, like sensors and cameras. There’s room for growing every segment of the semiconductor value chain when it comes to the nanometer race, or the specific technologies.”
That said, it is understood that certain products related to defense or critical infrastructure need to be obtained from domestic sources whenever possible.
“There are certain products that require end-to-end capability,” said the Commerce official. “But for the most part, we expect the industry and the supply chain to remain international, and we are not approaching the chips implementation as to create a technology autarchy in the United States. We would like to attract as much semiconductor innovation capability as well as production capacity as possible. We evaluate the economic and national security value depending on what end-uses they serve, and whether we have a gap in that production or not. There’s a team that is solely engaged in international work that recognizes certain products and certain specialized manufacturing will come from our allies, and that they are investing in things that are good for us, and we’re investing in things that are good for them, as well. We have to protect our critical and national security-related technologies. But we’re not out to create a fully sufficient and closed off, walled off technology ecosystem. We recognize that the industry is global and that it is remarkable global supply chains that make it work.”
Research and development
Along with manufacturing, another key focus for government funding is R&D, which SRC’s Younkin said falls into four main buckets — generative AI; smart manufacturing; autonomy and electrification, and cybersecurity.
“Generative AI is driving a wide variety of technologies,” said Younkin. “AI accelerator chips in the form of GPUs, FPGAs, new compute and memory solutions are coming into the market and the pain point is often the software used to program the chips. One of NVIDIA’s competitive elements is their CUDA ecosystem, which allows hundreds of thousands of programmers to unlock the power of their chips. Another example here is high-bandwidth memory, namely HBM 3 and 4. The announced SK hynix investment in West Lafayette, Indiana, will bring additional HBM 3e and 4 manufacturing to America as a key part of that NVIDIA AI acceleration wave.”
The next frontier is smart manufacturing and digital twins.
“If the CHIPS Act in the United States is going to be successful, it must drive more innovative, automated, cost-competitive, and holistic advances in nature,” said Younkin. “So what can we do to digitize the manufacturing processes to provide access for those that are not on the factory floor? How can we use that to train and upskill industry workers so they all have good jobs and exciting roles in this growing industry? And can we use it to keep our speed, yields, and costs at the forefront?”
The third bucket is autonomy and electrification, which includes self-driving cars, aerospace, power electronics, vehicle-to-vehicle, and vehicle-to-human communications, according to Younkin.
“Rad-hard [radiation hardened] systems, which are required for space-based operations, is an additional dynamic that is helping to drive the growth of wide-bandgap semiconductors and announcements such as Infineon’s new 300 millimeter gallium nitride technology,” he said.
Cybersecurity also is drawing significant attention and investment. “This is really a question of how you stay ahead of the hackers, but with growing emphasis on hardware solutions or new secure semiconductor technologies that will protect our critical infrastructure and, what’s under more visible attack, our enterprise and personal data,” said Younkin.
Ultimately, the focus of an R&D project needs to be able to attract funding if it ever wants to see the light of day and make it into practical use.
“Money flow determines where critical mass is achieved and, often, which ideas mature and materialize through the R&D pipeline,” said Younkin. “Fundamental academic research has a goal of publication to the benefit of humanity, and really has very few boundary conditions. That’s not true of all funding arrangements we see. When we look at governments, whether it’s Korea, the U.S. or the EU, they move about 5X slower, or at about 20% of the speed of industry. How they make up for that is by having a longer time horizon with larger objectives and funding that is typically more communal. The primary challenge with international cooperation is that it moves about 10X slower than that. So, you’re looking at ~0.2% of the speed of industry for well-funded international initiatives. Where an organization like SRC or imec is able to move at speed, it is often because we can direct the dollars to the right technology or location, and seek out, not funded partnerships, but joint ventures or partnerships that allow for progress based on independent funding. We can put funds there and move at industry-related speed, rather than be dependent upon the long-time constants that it takes to get first a domestic agenda and then an international agenda off the ground.”
Younkin pointed to EUV lithography, which took 30 years and billions of dollars in investment by hundreds of companies and several nations to achieve. But those outside of industry may have perceived it to be an overnight success.
“The pipeline problem at its heart is a capitalism problem,” he said. “R&D critically depends on where you put the incentives. With different nations structured in different ways, they all have pipelines that can fail at different points and for varied reasons.”
Workforce development
Another key government challenge is to build a talent pipeline to meet current and future needs when the proposed new facilities come online. To that end, governments have been linking up with industry and academia to try and fill the talent gap. For example:
Many chip companies also run global workforce initiatives with government partners. One major scheme is Arm’s Global Semiconductor Alliance, supported by Siemens, Cadence, Synopsys, SRC, and others. The Synopsys Academic & Research Alliances (SARA) program also extends worldwide.
“If you go to places where new ecosystems have emerged in terms of fabs or even packaging, and places like Southeast Asia, you’ll see a simultaneous buildup of capacity and factories and fabs, as well as an education and training ecosystem that is able to place workers within those fabs, and we are working towards that, and we fully expect that to happen within the United States as well,” said the Commerce official. “One thing that’s really exciting is our engagement with universities, local economic development agencies, as well as community colleges, to make sure that programs are in place, to place qualified workers within these factories, as well as these R&D ecosystems. And we’re seeing a tremendous amount of response to those things.”
SEMI is leading workforce development efforts on multiple fronts. “I won’t declare victory yet, but I would say there is a strong hope,” said Manocha. “The CHIPS Act and the onshoring will not be successful unless we solve the talent problem. And whether it’s a talent problem or a climate problem, no single company, country, or CEO can solve it. It requires collaboration at the national level, as well as the global level.”
One solution is for an international company that has net workers to send some of its skilled talent to work in a foreign outpost, as seen by TSMC in Arizona. This may become more common, as governments are investing in both domestic and international chip companies.
“It was always normal for multinational companies to bring experts from their country to a new site,” said Manocha. “Delays can happen if the ecosystem is suffering, but the government is very sensitive to support this. SEMI also plays a big role in ecosystem enablement so that we can take the entire value chain of semiconductor companies in different segments to that region, and make sure that we install the company, their shops or service centers, and so on.”
Below is a table of high-level government investments and initiatives from selected countries in the global semiconductor ecosystem. This is the first in a series of articles on government investments. Articles focused on 2024 announcements in North America, Europe, and Asia will follow.
[Editor’s note: There is some overlap in funding programs, and while Semiconductor Engineering strives to be thorough, there may be others that are not included. In addition, some programs encompass more than just semiconductors, so the total investment may be different than the totals by adding up all of the different programs.]
Region | Program / Date | Investment | Details | ||||
---|---|---|---|---|---|---|---|
Canada (Jun 21) |
CMC’s FABrIC | Aiming to attract $480M in industrial R&D with $120M from the govt.’s Strategic Innovation Fund | Non-profit CMC Microsystems brought together 14 founders to support the 5-year program, Fabrication of Integrated Components for the Internet’s Edge – FABrIC | ||||
China (May 24) |
Phase 3 of the National Integrated Circuit Industry Investment Fund | The “Big Fund” has three phases: 2014 to 2019 (~$22B); 2019 to 2024 (~$30B); 2024 to 2039 (~$48B) for about $100B total | The latest round aims to boost large-scale manufacturing and equipment, materials, HBM, AI chips | ||||
Europe (Apr 19) |
Horizon Europe | €100B until 2027, including financing for the EU Chips Act | Research and innovation | ||||
Europe (Sep 23) |
European Chips Act | €3.3B of Horizon Europe funds, expected to be matched by funds from Member States | Strengthen the semiconductor ecosystem | ||||
Europe (Nov 23) |
Chips Joint Undertaking | First call for proposals with €1.67B EU funding to be matched by Member States plus private funds; a second call was for €216 million | Set up pre-commercial, innovative pilot lines; deploy a cloud-based Design Platform for design companies; support advanced technology and engineering capacities for quantum chips; skills development | ||||
Europe (Oct 18) |
Quantum Technologies Flagship | Initially fund 20 projects with €132M via the Horizon 2020 programme; from 2021 expected to fund a further 130 projects with total expected budget of €1B | Develop a quantum web, where quantum computers, simulators, sensors are interconnected via quantum communication networks | ||||
Europe (Jun 14) |
ECSEL Joint Undertaking | Total €4.815 billion; €1.215 billion from the EU, €1.2 billion from member states and around €2.4 billion from industry | Electronic Components and Systems for European Leadership; formed with the merge of ARTEMIS-JU and ENIAC-JU in June 2014 and will finish in 2024 | ||||
Europe (May 13) |
New European Industrial Strategy for Electronics | Targeted govt. support to mobilize €100 billion in new private investments | Coordinated R&D; reinforce electronics clusters; cheaper, faster, smarter chips | ||||
India (Dec 21) |
India Semiconductor Mission | INR 76,000 crore (~$10B) | Build a vibrant semiconductor and display ecosystem; supported by the Chips to Startup (C2S) Program for workforce development | ||||
India (Apr 23) |
National Quantum Mission | INR 6003.65 crore (~$740M) | Scale scientific, industrial R&D for quantum technology-led economic growth | ||||
India (Mar 24) |
IndiaAI Mission | INR 10,300 crore (~$1.24B) | Empower AI startups and expand compute infrastructure access | ||||
Japan (Jun 21) |
Strategy for Semiconductors and Semiconductor Funding Program | FY 2022-onwards: ¥1,699B (~$11.9B) plus a subsidies program | Boost production of cutting-edge logic semiconductors; identify targets and leaders in memory, sensors, power, and microcomputers | ||||
Japan (Jun 21) |
Specified Semiconductor Funding Program | FY 2022-onwards: ¥1,699B (~$11.9B); program for Specified Semiconductor Interest Subsidies Project period: FY 2022-onwards: ¥30M (~$209K) | Agencies include New Energy and Industrial Technology Development Organization (NEDO); Ministry of Economy, Trade and Industry (METI); Japan External Trade Organization (JETRO) | ||||
Japan (Dec 21) |
Revised 5G Promotion Act | Certification program and support | For semiconductors that enable high-speed processing of large amounts of information for 5G information and communication systems | ||||
Japan (Jul 24) |
Semiconductor Revitalization Strategy | FY2021: ¥774B ($5.5B); FY2022: Total ¥1.3 trillion ($9B); FY2023: Total ¥1.85 trillion ($13B) | A summary provided by Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry |
||||
Malaysia (May 24) |
National Semiconductor Strategy | Govt. to invest $5.3B in an effort to attract over $100B industry investment | Aims to establish at least 10 Malaysian companies in design, advanced packaging; offer the nation as a neutral location | ||||
South Korea (Mar 19) |
Yongin Semiconductor Cluster | Govt. to ease regulatory procedures to attract about KRW 120 trillion (~$90B) private investment over 10 years | 4 main fabs to be located in a site up to 4.46M sq-m along with over 50 suppliers | ||||
South Korea (May 21) |
K-Semiconductor Strategy | Govt. tax deductions and infrastructure packages to support industry investment of over KRW 510 trillion (~$385B) until 2030 | The “K-Chip Belt” connects Pangyo with Kiheung, Hwaseong, Pyeongtaek, Onyang from North to South and Icheon and Cheongju to Yongin from East to West creating a “K” shaped belt | ||||
South Korea (May 24) |
Semiconductor Ecosystem Support Package | KRW 26 trillion (~$19.03B); see June 24 update and Oct 24 update | Establish semiconductor supremacy amid the intensified global battle; follows increased subsidies in Sep 23 | ||||
Taiwan (Nov 23) |
Taiwan Chip-based Industrial Innovation Program | NT$300B (~$9.3B) for implementation between 2024 and 2033 | Leverage Taiwan’s leading global position in chip manufacture, packaging, testing to develop new applications through integrating Si chips with critical technologies such as GenAI; follows International and A+ subsidy programs | ||||
UK (May 23) |
National Semiconductor Strategy | Up to £200M (~$263M) over 2023 to 2025; up to £1B (~$1.3B) in the next decade; steered by the UK Semiconductor Institute | Secure areas of world leading strength by focusing on R&D, design and IP, compound semiconductors | ||||
UK (Mar 23) |
National Quantum Strategy | £2.5B (~$3B) over 10 years from 2024 | Fund new frontiers of quantum research; support and develop quantum sector; prepare wider economy; lead internationally in the regulation and ethical use of quantum technologies | ||||
USA (Aug 22) |
CHIPS and Science Act | $53B | Boost semiconductor R&D; reshore manufacturing | ||||
USA (Feb 21) |
National Defense Industrial Strategy | U.S. Dept. of Defense (DoD) obligated over $893M under the Defense Production Act | Critical sectors include microelectronics, energy storage and batteries, strategic and critical materials | ||||
USA (Dec 18) |
National Quantum Initiative Act | Ongoing investments such as $39M for research, training in Sept 24; 41M to a quantum Tech Hub in Jul 24 | Establish a 10-year plan to accelerate the development of quantum information science and technology applications | ||||
Vietnam (Apr 24) |
Human resource development in semiconductor industry | Total required budget of about VND 26,000B (~$1B) of which the state budget to contribute about VND 17,000B (~$690.7M) and socialized sources about VND 9,000B ($365.7M) | Aims for Vietnamese engineers to deeply engage in the design processes, packaging, testing stages; master parts of packaging, testing technologies; gradually grasp production technologies | ||||
Vietnam (Sep 24) |
Vietnam Semiconductor Industry Development Strategy | Investment not disclosed; targeting revenue of $25B by 2030 and $100B by 2050 | Phase 1 aims to set up 100 design companies, 1 small-scaled fab and 10 packaging, testing plants; develop specialized semiconductor products for several sectors; offers Vietnam as a safe new destination for the global supply chain | ||||
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