Rethinking Design, Workflow For 3D


In the 3D world, where NAND has hundreds of layers and packages come in intricate stacks, fresh graduates and veteran engineers alike are being confronted with design challenges that require a rethinking of both classic designs and traditional workflows, but without breaking the laws of physics. “There are pockets of things that have been on 3D for quite some time,” said Kenneth Larson, ... » read more

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)


A technical paper titled “Vertical Power Delivery for Emerging Packaging and Integration Platforms – Power Conversion and Distribution” was published by researchers at University of Illinois Chicago. Abstract: "Efficient delivery of current from PCB to point-of-load (POL) is a primary concern in modern high-power high-density integrated systems. Traditionally, a 48 V power signal is con... » read more

Chiplets: Bridging The Gap Between The System Requirements And Design Aggregation, Planning, And Optimization


A technical paper titled “System and Design Technology Co-optimization of Chiplet-based AI Accelerator with Machine Learning” was published by researchers at Auburn University. Abstract: "With the availability of advanced packaging technology and its attractive features, the chiplet-based architecture has gained traction among chip designers. The large design space and the lack of sys... » read more

Site-Specific Compositional Info from Periodic Nanostructures Obtained Using Rutherford Backscattering Spectrometry


A new technical paper titled "Quantification of area-selective deposition on nanometer-scale patterns using Rutherford backscattering spectrometry" was published by researchers at IMEC and KU Leuven. "We present a site-specific elemental analysis of nano-scale patterns whereby the data acquisition is based on Rutherford backscattering spectrometry (RBS). The analysis builds on probing a larg... » read more

3D Racetrack Memory Device (Max Planck)


A new technical paper titled "Three-dimensional racetrack memory devices designed from freestanding magnetic heterostructures" was published by researchers at Max Planck Institute of Microstructure Physics in Halle, Germany. "Magnetic racetrack memory encodes data in a series of magnetic domain walls that are moved by current pulses along magnetic nanowires. To date, most studies have focuse... » read more

Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures


Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these new 3D structures — some on the horizon but some already in high-volume manufacturing — semiconductor wafer equipment and materials suppliers in the wet cleaning business are at the epicenter... » read more

Chipmaking In The Third Dimension


Every few months, new and improved electronics are introduced. They’re typically smaller, smarter, faster, have more bandwidth, are more power-efficient, etc. — all thanks to a new generation of advanced chips and processors. Our digital society has come to expect this steady drip of new devices as sure as the sun will rise tomorrow. Behind the scenes, however, engineers are working feve... » read more

Inverse Design of Inflatable Soft Membranes Through Machine Learning


Abstract "Across fields of science, researchers have increasingly focused on designing soft devices that can shape-morph to achieve functionality. However, identifying a rest shape that leads to a target 3D shape upon actuation is a non-trivial task that involves inverse design capabilities. In this study, a simple and efficient platform is presented to design pre-programmed 3D shapes starting... » read more

Future Challenges For Advanced Packaging


Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Industrial Radiography — CT Scanning for Metrology Applications


Xray technology, more specifically computed tomography (CT), has been adapted for use as an instrument of industrial metrology. Early adopters have quickly recognized the benefits of internal and external nondestructive testing for 3D defect detection and geometric analysis, while those considering adoption may be uncertain how to implement the technology effectively. This study was conducted t... » read more

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