tag: AI

Rethinking What Goes On A Chip
By Ed Sperling - 27 Jun, 2019 - Comments: 0

There are hints across the chip industry that chipmakers are beginning to reexamine one of the basic concepts of chip design. For more than 50 years, progress in semiconductors was measured by the ability to double the density of transistors on a piece of silicon. While that approach continues to be useful, the power and performance benefits have been dwindling for the past couple of nodes. ... » read more

Providing An AI Accelerator Ecosystem
By David Burnette - 27 Jun, 2019 - Comments: 0

A key design area for AI systems is the creation of Machine Learning (ML) algorithms that can be accelerated in hardware to meet power and performance goals. Teams designing these algorithms find out quickly that a traditional RTL design flow will no longer work if they want to meet their delivery schedules. The algorithms are often subject to frequent changes, the performance requirements may ... » read more

Open Source Processors: Fact Or Fiction?
By Brian Bailey - 27 Jun, 2019 - Comments: 3

Open source processors are rapidly gaining mindshare, fueled in part by early successes of RISC-V, but that interest frequently is accompanied by misinformation based on wishful thinking and a lack of understanding about what exactly open source entails. Nearly every recent conference has some mention of RISC-V in particular, and open source processors in general, whether that includes keyno... » read more

Google Cloud—A View From The Top
By Mike Gianfagna - 27 Jun, 2019 - Comments: 0

I recently had the opportunity to attend a retreat-style event in Napa Valley hosted by the Google Cloud team. Like many such events I’ve attended over the years, the guests were treated to excellent accommodations, fabulous food, a good amount of free time for networking or to partake in activities, relevant and on-point presentations and world-class wine (this is Napa Valley after all). All... » read more

Test Chips Play Larger Role At Advanced Nodes
By Ann Mutschler - 27 Jun, 2019 - Comments: 0

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs. Semiconductor designers have long b... » read more

Verification In The Cloud
By Ed Sperling - 27 Jun, 2019 - Comments: 0

Christen Decoin, senior director of business development at Synopsys, talks with Semiconductor Engineering about what’s changed for EDA in the cloud, why it has taken so long, and what new benefits the cloud will offer. Rules have changed at foundries, and the customer base for designs is evolving. » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War
By Ed Sperling - 26 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Factoring Reliability Into Chip Manufacturing
By Ed Sperling - 20 Jun, 2019 - Comments: 0

Making chips that can last two decades is possible, even if it's developed at advanced process nodes and is subject to extreme environmental conditions, such as under the hood of a car or on top of a light pole. But doing that at the same price point as chips that go into consumer electronics, which are designed to last two to four years, is a massively complex challenge. Until a couple of y... » read more

Wrestling With High-Speed SerDes
By Ann Mutschler - 19 Jun, 2019 - Comments: 2

SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

Power, Reliability And Security In Packaging
By Ed Sperling - 19 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; and Tien Shiah, senior manager for memory at Samsun... » read more

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