tag: Advantest

The Week In Review: Manufacturing
By Mark LaPedus - 26 Nov, 2014 - Comments: 2

Has extreme ultraviolet (EUV) lithography finally turned the corner after numerous delays and setbacks? The big test for EUV could reside at TSMC. “TSMC ordered two new EUV tools (from ASML), and is expected to use four EUV tools in total (with the two new orders) for its 10nm process (likely one layer, ramping in 2016 or 2017). EUV remains far from ready for broad adoption, in our view, but ... » read more

ATE Market Gets More Crowded
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Over the years, the automatic test equipment (ATE) industry has undergone a dramatic shakeout. In fact, the ATE industry has shrunk from about a dozen major vendors several years ago to just three sizable companies today. There is also a smattering of smaller ATE players in the market. In other words, the big ATE vendors became bigger and the mid-sized players were gobbled up. The consol... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Sep, 2014 - Comments: 0

Tesla Motors plans to build a new 35-GWh, lithium-ion cell production facility for its electric vehicles. It sounds like a good idea. But the factory will bring about only a modest reduction in battery costs, and could create significant overcapacity in the arena, according to Lux Research. “The Gigafactory will only reduce the Tesla Model 3’s cost by $2,800, not enough to sway the success ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Aug, 2014 - Comments: 0

Intel announced two new technologies for foundry customers. One technology, dubbed Embedded Multi-die Interconnect Bridge (EMIB), is available to 14nm foundry customers. Instead of an expensive silicon interposer with TSVs, a small silicon bridge chip is embedded in the package, enabling high density die-to-die connections only where needed. EMIB eliminates the need for TSVs and specialized int... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Aug, 2014 - Comments: 0

Many are suffering from “fragiphoniphobia” without even realizing it, according to Kyocera. This is the fear of fragile phones and worries about the drops and spills ruining our smartphones and disrupting our lives. A recent survey from comScore revealed that 73% of consumers surveyed rated drop protection or scratch-proof/shatter-proof screens as the most desirable durability feature, whil... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Aug, 2014 - Comments: 0

Fujitsu Semiconductor and Panasonic’s chip unit announced that the parties have signed a definitive agreement to merge and establish a new fabless IC company. Panasonic isn’t exactly fabless--yet. Recently, Panasonic took its fabs and formed a fab venture with TowerJazz. Meanwhile, as part of the move, Fujitsu and Fujitsu Semiconductor have decided to expand the scope of its foundry op... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Jul, 2014 - Comments: 0

Here’s a sad commentary on the state of Japan’s electronics industry: Some Japanese electronics giants are converting unused factories and fabs into agricultural growing facilities, according to The Wall Street Journal. Last month, for example, Fujitsu began selling lettuce from the Aizu-Wakamatsu plant. It's officially over. IBM's talks to sell its chip unit to GlobalFoundries have offi... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jul, 2014 - Comments: 0

Looking to address a new wave of chip architectures in the marketplace, Applied Materials has rolled out its next-generation, medium-current ion implanter. The system, dubbed the VIISta 900 3D, is geared for the production of finFETs and 3D NAND designs at the sub-2xnm nodes. Typically, medium-current implanters have a maximum energy range of about 900keV (triple-charge), with dose ranges fr... » read more

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