Making Lidar More Useful

By Ed Sperling - 07 Jun, 2021 - Comments: 0

Lidar, one of a trio of “vision” technologies slated for cars of the future, is improving both in terms of form and function. Willard Tu, director of automotive at Xilinx, talks with Semiconductor Engineering about different approaches and tradeoffs between cost, compute intensity and resolution, various range and field of view options, and why convolutional neural networks are so important... » read more

Week In Review: Design, Low Power

By Jesse Allen - 10 Jan, 2020 - Comments: 0

Synopsys will acquire certain IP assets of INVECAS. The acquisition expands Synopsys' DesignWare Logic Library, General Purpose I/O, Embedded Memory, Interface and Analog IP portfolio. The acquisition will also add a team of experienced R&D engineers to focus on physical IP across a range of process technologies. INVECAS will retain its HDMI IP and ASIC Design Solutions businesses. The deal... » read more

Week In Review: IoT, Security, Autos

By Susan Rambo - 10 Jan, 2020 - Comments: 0

Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Dec, 2018 - Comments: 0

Internet of Things Internet of Things vendors and providers of network services need to collaborate to fully realize the possibilities presented by the IoT, Chris Martin of PowWowNow writes. “The potential applications for IoT sensors and devices span a vast number of industries, with IoT technologies expediting the growth of smart cities, autonomous vehicles and connected industry technolog... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: AEye

Making Lidar More Useful

Week In Review: Design, Low Power

Week In Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto