Week In Review: Design, Low Power

By Marie C. Baca - 02 Sep, 2022 - Comments: 0

Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Jul, 2019 - Comments: 0

Products/Services Arm rolled out its Flexible Access program, which offers system-on-a-chip design teams the capability to try out the company’s semiconductor intellectual property, along with IP from Arm partners, before they commit to licensing IP and to pay only for what they use in production. The new engagement model is expected to prove useful for Internet of Things design projects and... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 May, 2019 - Comments: 0

Internet of Things Paris-based Parrot Drones and five other companies were selected by the Pentagon’s Defense Innovation Unit and the U.S. Army to adapt off-the-shelf commercial drones for combat applications as part of the Army’s Short Range Reconnaissance program. SRR seeks to develop unmanned aerial vehicles that have a flight time of 30 minutes, a range of three kilometers (nearly two ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Axios

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto