Revving Up For Edge Computing

By Ed Sperling - 07 Nov, 2019 - Comments: 1

The edge is beginning to take shape as a way of limiting the amount of data that needs to be pushed up to the cloud for processing, setting the stage for a massive shift in compute architectures and a race among chipmakers for a stake in a new and highly lucrative market. So far, it's not clear which architectures will win, or how and where data will be partitioned between what needs to be p... » read more

Week In Review: Design, Low Power

By Jesse Allen - 01 Nov, 2019 - Comments: 0

Micron acquired FWDNXT, an AI software and hardware startup. Founded in 2017 and based in Lafayette, Indiana, FWDNXT, specializes in building machine learning deep neural network inference accelerators scalable from edge devices to server-class performance as Xilinx FPGAs, SoCs, or SDK. The company's engine already powers Micron's Deep Learning Accelerator (DLA) technology. “FWDNXT is an a... » read more

Week in Review: IoT, Security, Autos

By Susan Rambo - 01 Nov, 2019 - Comments: 0

IoT/Edge Achronix teamed up with Bittware to develop a smart accelerator card based on a 7nm FPGA from Achronix. The card is targeted for edge devices, where pre-processing and acceleration of data movement is critical due to the enormous quantity of data being generated by sensors. The strategy is to move the processing closer to the data, rather than processing input from multiple sensors in... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: BittWare

Revving Up For Edge Computing

Week In Review: Design, Low Power

Week in Review: IoT, Security, Autos