Startup Funding: July 2020

By Jesse Allen - 05 Aug, 2020 - Comments: 0

A number of semiconductor and design companies took in funding this month, from a mega round for a data center switch maker to seed grants for two Canadian companies and new funding for an IP marketplace. China continues to be a hot area for electric vehicles, with one company raising half a billion for its two models currently in production. For July, we highlight fifteen startups that raised ... » read more

Startup Funding: January 2020

By Jesse Allen - 05 Feb, 2020 - Comments: 0

A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

Over $7 Billion Raised In Mega-Rounds By 27 Firms

By Jeff Dorsch - 02 Oct, 2019 - Comments: 0

It was also a good month for private equity firms and venture capitalists to raise their own rounds, with the money to be invested in early-stage companies and more mature ventures. A semiconductor company led the month. Nexperia, once the Standard Products business unit of NXP Semiconductors, took in $1.5 billion of senior credit facilities. The money will go toward refinancing debt and par... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Sep, 2018 - Comments: 0

Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

The Week in Review: IoT

By Jeff Dorsch - 16 Feb, 2018 - Comments: 0

Finance Cincinnati-based Losant, which offers an enterprise Internet of Things platform, reports raising $5.2 million in Series A funding led by CincyTech. The Rise of the Rest Seed Fund, TechNexus, and Vine Street Ventures also participated in the new round. Losant says customers for its scalable IoT platform include Bosch, Hewlett Packard Enterprise, and Verizon Communications. SAM of Tel... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.