Startup Funding: February 2023

By Jesse Allen - 08 Mar, 2023 - Comments: 0

The cost of borrowing is going up, but investors continued to pour money into the chip industry in February. Collectively, 132 companies raised more than $4.5 billion last month. One of the big beneficiaries was quantum computing, with nine companies drawing a total of more than $500 million. The bulk of that went to a quantum software and services company spun out of Alphabet, but plenty wa... » read more

Startup Funding: March 2022

By Jesse Allen - 04 Apr, 2022 - Comments: 0

Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts f... » read more

Investors Back IoT Startups

By Jeff Dorsch - 07 Mar, 2018 - Comments: 0

Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

The Week in Review: IoT

By Jeff Dorsch - 19 Jan, 2018 - Comments: 0

Finance VDOO Connected Trust received $13 million in seed funding led by 83North, with participation by Dell Technology Capital and individual investors David Strohm, Joe Tucci, and Victor Tsao. The startup offers Internet of Things device developers the capability to add cybersecurity features to those devices after they’re deployed. VDOO was founded last year in Israel by Netanel Davidi, U... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Breyer Capital

Startup Funding: February 2023

Startup Funding: March 2022

Investors Back IoT Startups

The Week in Review: IoT

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