Software-Defined Hardware Architectures

By Brian Bailey - 31 May, 2023 - Comments: 0

Hardware/software co-design has been a goal for several decades, but success has been limited. More recently, progress has been made in optimizing a processor as well as the addition of accelerators for a given software workload. While those two techniques can produce incredible gains, it is not enough. With increasing demands being placed on all types of processing, single-processor solutio... » read more

Week In Review: Design, Low Power

By Jesse Allen - 28 May, 2021 - Comments: 0

Valens Semiconductor will become a publicly traded company on NYSE as VLN after a merger with PTK Acquisition Corp. Valens provides long-reach, high-speed video and data transmission for the audio-video and automotive industries. The transaction is expected to provide proceeds of approximately $240 million, including up to $115 million in trust from PTK Acquisition Corp. (assuming no redemption... » read more

Synthesizing Hardware From Software

By Brian Bailey - 22 Aug, 2019 - Comments: 1

The ability to automatically generate optimized hardware from software was one of the primary tenets of system-level design automation that was never fully achieved. The question now is whether that will ever happen, and whether it is just a matter of having the right technology or motivation to make it possible. While high-level synthesis (HLS) did come out of this work and has proven to be... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Software-Defined Hardware Architectures

Week In Review: Design, Low Power

Synthesizing Hardware From Software