tag: Cadence

New Deep Learning Processors, Embedded FPGA Technologies, SoC Design Solutions
By Ty Garibay - 14 May, 2018 - Comments: 0

Some of the most valuable events at DAC are the IP Track sessions, which give small and midsize companies a chance to share innovations that might not get much attention elsewhere. The use of IP in SoCs has exploded in recent years. In a panel at DAC 2017, an industry expert noted that the IP market clearly was growing even faster than EDA itself, due to the fact that more and more chip mak... » read more

The Week In Review: Design
By Jesse Allen - 11 May, 2018 - Comments: 0

M&A IoT-focused memory chipmaker Adesto Technologies acquired S3 Semiconductors, a provider of mixed-signal and RF ASICs and IP. Based in Ireland, S3 Semiconductors was founded in 1986. S3 Semiconductors will become a business unit of Adesto and will continue to operate under its current model in the $35 million deal. S3 Semiconductor's parent company, S3 Group, will continue as a separate... » read more

Power Optimization Strategies Widen
By Brian Bailey - 10 May, 2018 - Comments: 0

An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

Where The Rubber Hits The Road: Implementing Machine Learning On Silicon
By Dave Pursley - 10 May, 2018 - Comments: 0

Machine learning (ML) is everywhere these days. The common thread between advanced driver-assistance systems (ADAS) vision applications in our cars and the voice (and now facial) recognition applications in our phones is that ML algorithms are doing the heavy lifting, or more accurately, the inferencing. In fact, neural networks (NN) can even be used in application spaces such as file compressi... » read more

System-Level Power Modeling Takes Root
By Ann Mutschler - 10 May, 2018 - Comments: 0

Power, heat, and their combined effects on aging and reliability, are becoming increasingly critical variables in the design of chips that will be used across a variety of new and existing markets. As more processing moves to edge, where sensors are generating a tsunami of data, there are a number of factors that need to be considered in designs. On one side, power budgets need to reflect th... » read more

Does Power Verification Work?
By Brian Bailey - 10 May, 2018 - Comments: 1

Functional verification continues to evolve, but power verification—a somewhat new concern—remains at levels of sophistication reminiscent of functional verification 30 years ago. When will power verification catch up and what must to happen to make it possible? These are questions that the industry is still grappling with, and not everyone believes they require answers. Functional error... » read more

Blog Review: May 9
By Jesse Allen - 09 May, 2018 - Comments: 0

Mentor's Doug Amos explains the differences (and similarities) between verification and validation, why switching between engines needs to be simpler, and why the limits of verification are driving a growth in validation importance. Synopsys' Melissa Kirschner provides a primer on 5G and the five technologies that will need to work in tandem to bring the promised high speeds and low latency.... » read more

The Week In Review: Design
By Jesse Allen - 04 May, 2018 - Comments: 0

M&A ANSYS finalized its acquisition of OPTIS. Founded in 1989, OPTIS provided software for scientific simulation of light, human vision and physics-based visualization. The acquisition boosts the company's automotive simulation portfolio with radar, lidar and camera simulation. Terms were not disclosed. IP Arm debuted the Cortex-M35P processor. Aimed at IoT applications, the IP combine... » read more

Tech Talk: eFPGA Timing
By Ed Sperling - 03 May, 2018 - Comments: 0

Flex Logix's Chen Wang talks about timing for an embedded FPGA and how that differs from ASIC timing. https://youtu.be/n88D1N4IEbs » read more

Blog Review: May 2
By Jesse Allen - 02 May, 2018 - Comments: 0

Arm's Greg Yeric looks towards the future of 3D ICs with a dive into transistor-level 3D, including the different proposed methods of stacking transistors, power/performance benefits, and challenges such as parasitic resistance. Mentor's Kurt Takara, Chris Kwok, Dominic Lucido, and Joe Hupcey III explain how a custom synchronizer methodology can help avoid CDC mistakes and errors in FPGA des... » read more

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