Chip Industry Week In Review

By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

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Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

The Race To Glass Substrates

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

by Gregory Haley

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Controlling Warpage In Advanced Packages

Mechanical stresses increase with larger sizes and heterogeneous materials.

by Laura Peters

Electrically Controlled All-AFM Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance (Northwestern)

by Technical Paper Link

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

by Ed Sperling

tag: Chandler Unified School District

Chip Industry Week In Review

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Intel Vs. Samsung Vs. TSMC