Startup Funding: March 2021

By Jesse Allen - 07 Apr, 2021 - Comments: 0

Self-driving vehicles revved up investors in March, with two companies receiving over $200M apiece as they prepare for their systems to enter mass production. One focuses on software for passenger vehicles, while the other is looking to autonomous trucks. Both of the companies received investment from automakers, with China's largest carmaker SAIC joining each of the funding rounds. It was also... » read more

Startup Funding: February 2021

By Jesse Allen - 01 Mar, 2021 - Comments: 0

In February, several startups emerge from stealth, with one company working on AI inference architectures for the data center and another trying to make lenses thinner by patterning surfaces with tiny structures. Two new Chinese companies are trying to expand the country's semiconductor design ecosystem with GPUs and interface IP. Plus, a maker of AI chips for ADAS draws another massive round t... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ClearVue Partners

Startup Funding: March 2021

Startup Funding: February 2021

Week in Review: IoT, Security, Auto